C11D 7/3209
Amines or imines with one to four nitrogen atoms
Official title: {Amines or imines with one to four nitrogen atoms; Quaternized amines}
C11D7/3209 (Amines or imines with one to four nitrogen atoms) appears on 456 US grants and 580 published applications in this corpus.
Search patents in C11D- Granted patents
- 456
- Published applications
- 580
- Assignees
- 231
- Inventors
- 1,171
- Latest grant
- 16 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 1 | 0 |
| 1979 | 2 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 4 | 0 |
| 1985 | 2 | 0 |
| 1986 | 1 | 0 |
| 1987 | 2 | 0 |
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 2 | 0 |
| 1992 | 1 | 0 |
| 1993 | 1 | 0 |
| 1994 | 6 | 0 |
| 1995 | 4 | 0 |
| 1996 | 6 | 0 |
| 1997 | 7 | 0 |
| 1998 | 7 | 0 |
| 1999 | 9 | 0 |
| 2000 | 15 | 0 |
| 2001 | 20 | 10 |
| 2002 | 15 | 26 |
| 2003 | 13 | 15 |
| 2004 | 10 | 35 |
| 2005 | 14 | 22 |
| 2006 | 16 | 28 |
| 2007 | 8 | 15 |
| 2008 | 7 | 12 |
| 2009 | 10 | 19 |
| 2010 | 7 | 18 |
| 2011 | 16 | 22 |
| 2012 | 12 | 17 |
| 2013 | 15 | 25 |
| 2014 | 24 | 19 |
| 2015 | 17 | 36 |
| 2016 | 23 | 37 |
| 2017 | 19 | 21 |
| 2018 | 22 | 21 |
| 2019 | 19 | 19 |
| 2020 | 18 | 15 |
| 2021 | 18 | 20 |
| 2022 | 14 | 28 |
| 2023 | 12 | 20 |
| 2024 | 9 | 30 |
| 2025 | 13 | 21 |
| 2026 | 11 | 29 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Metal residue removing liquid, metal residue removing method, and metal wiring manufacturing method16 Jun 2026US 12,655,370 B2Tokyo Ohka Kogyo.Co., Ltd.
- Substrate treating method16 Jun 2026US 12,660,547 B2SCREEN Holdings Co., Ltd.
- Cleaning agent composition and cleaning method12 May 2026US 12,624,318 B2Nissan Chemical Corporation
- Treatment liquid for semiconductor wafers, which contains hypochlorite ions28 Apr 2026US 12,612,580 B2Tokuyama Corporation
- Active agent-containing articles21 Apr 2026US 12,606,779 B2The Procter & Gamble Company
- Processing solution, method for processing semiconductor substrate, and method for manufacturing semiconductor device1 Oct 2026US 2026/0297465 A1Tokyo Ohka Kogyo.Co., Ltd.
- Cleaning composition and method of forming photoresist pattern using the same1 Oct 2026US 2026/0297469 A1Dongwoo Fine-Chem Co., Ltd.
- Surface treatment agent, silicon compound, and method for suppressing pattern collapse when substrate surface is cleaned with cleaning liquid24 Sep 2026US 2026/0286256 A1Tokyo Ohka Kogyo.Co., Ltd.
- Solvent-based compositions for post-etch residue removal and related methods27 Aug 2026US 2026/0250607 A1Entegris, Inc.
- Treatment liquid, cleaning method for object to be treated, and manufacturing method of electronic device13 Aug 2026US 2026/0234507 A1FUJIFILM Corporation
Most cited
By later US patents
- Cleaning compositions for removing etching residue and method of using150US 5,334,332 AEKC Technology, Inc. · 1994
- Post clean treatment composition comprising an organic acid and hydroxylamine137US 5,981,454 AEKC Technology, Inc. · 1999
- Washing apparatus126US 6,691,536 B2The Procter & Gamble Company · 2004
- Silicate-containing alkaline compositions for cleaning microelectronic substrates102US 6,465,403 B12002
- Stripping compositions comprising hydroxylamine and alkanolamine89US 5,279,771 AEKC Technology, Inc. · 1994