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US 12,660,547 B2Granted
Substrate treating method
AssigneeSCREEN Holdings Co., Ltd.
InventorYuta Sasaki
Life of this patent
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Abstract
The substrate treating liquid according to the present invention can be used for removing a liquid on a substrate such as a semiconductor substrate having a pattern-formed surface, and is characterized by including cyclohexanone oxime as a sublimable substance, and at least one solvent selected from the group consisting of alcohols, ketones, ethers, cycloalkanes and water.
Claims7
A substrate treating method for removing a liquid on a substrate having a pattern-formed surface, comprising:
- conducting a supplying step of supplying a substrate treating liquid to the pattern-formed surface,
- wherein the substrate treating liquid comprises cyclohexanone oxime as a sublimable substance and a solvent comprising at least alcohols.
Dependencies are inferred from the claim text.