C09G 1/04
Aqueous dispersions
Official title: Aqueous dispersions (C09G1/02 takes precedence)
C09G1/04 (Aqueous dispersions) appears on 371 US grants and 454 published applications in this corpus.
Search patents in C09G- Granted patents
- 371
- Published applications
- 454
- Assignees
- 186
- Inventors
- 975
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 3 | 0 |
| 1977 | 2 | 0 |
| 1978 | 0 | 0 |
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 3 | 0 |
| 1989 | 2 | 0 |
| 1990 | 2 | 0 |
| 1991 | 2 | 0 |
| 1992 | 3 | 0 |
| 1993 | 3 | 0 |
| 1994 | 1 | 0 |
| 1995 | 7 | 0 |
| 1996 | 4 | 0 |
| 1997 | 3 | 0 |
| 1998 | 8 | 0 |
| 1999 | 6 | 0 |
| 2000 | 5 | 0 |
| 2001 | 4 | 1 |
| 2002 | 4 | 5 |
| 2003 | 10 | 15 |
| 2004 | 9 | 14 |
| 2005 | 7 | 12 |
| 2006 | 6 | 20 |
| 2007 | 14 | 10 |
| 2008 | 8 | 13 |
| 2009 | 0 | 10 |
| 2010 | 3 | 9 |
| 2011 | 4 | 6 |
| 2012 | 8 | 7 |
| 2013 | 9 | 12 |
| 2014 | 12 | 13 |
| 2015 | 9 | 33 |
| 2016 | 23 | 23 |
| 2017 | 15 | 29 |
| 2018 | 20 | 22 |
| 2019 | 20 | 25 |
| 2020 | 15 | 34 |
| 2021 | 32 | 38 |
| 2022 | 27 | 28 |
| 2023 | 16 | 18 |
| 2024 | 15 | 28 |
| 2025 | 13 | 16 |
| 2026 | 11 | 13 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Methods of forming an abrasive slurry and methods for chemical-mechanical polishing29 Sep 2026US 12,746,637 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Polishing composition for semiconductor process and method for polishing a substrate using the same22 Sep 2026US 12,742,096 B2Ycchem Co., Ltd.
- Compositions for polishing hardmasks and related systems and methods22 Sep 2026US 12,742,097 B2Entegris, Inc.
- Chemical mechanical polishing composition and polishing method22 Sep 2026US 12,742,098 B2Jsr Corporation
- Polishing liquid for polishing compound semiconductor substrate28 Jul 2026US 12,692,415 B2Disco Corporation
- Polishing compositions and methods of use thereof24 Sep 2026US 2026/0286184 A1Fujifilm Electronic Materials U.S.A., Inc.
- Polishing composition and polishing method24 Sep 2026US 2026/0286185 A1Fujimi Incorporated
- Polishing slurry and method of manufacturing semiconductor device24 Sep 2026US 2026/0286186 A1Samsung Electronics Co., Ltd.
- Slurry that suppresses reduction of lifetime of polishing pad and method for evaluating damage caused by slurry to polishing pad24 Sep 2026US 2026/0286187 A1
- Polishing composition, method for producing substrate, and polishing system24 Sep 2026US 2026/0286188 A1Fujimi Incorporated
Most cited
By later US patents
- Impregnated wiper110US 3,965,518 AS. C. Johnson & Son, Inc. · 1976
- Method for cleansing and lustering a surface85US 5,399,205 ATaiho Industries Co., Ltd. · 1995
- Optical resonators with reduced OH-content45US 7,248,763 B1OEwaves, Inc. · 2007
- Polish containing amine functional siloxane42US 5,154,759 ADow Corning Corporation · 1992
- Self-stripping coating composition38US 4,013,607 AS. C. Johnson & Son, Inc. · 1977