Polishing composition and polishing method

Abstract

The present disclosure provides a polishing composition which allows the polishing removal rate of a material having a silicon-silicon bond to be enhanced and which is also excellent in step height reduction ability on a polishing object including the material having a silicon-silicon bond. The present disclosure relates to a polishing composition including (A) a water-soluble polymer containing a lactam structure and (B) an amine compound, wherein the (B) component has 7 or more and less than 17 carbon atoms and a content mass ratio of the (B) component to the (A) component ((B) component/(A) component) is more than 1.

Dependencies are inferred from the claim text.