Polishing composition, method for producing substrate, and polishing system

Abstract

The present disclosure provides a polishing composition excellent in the balance among an excellent unevenness elimination ability on an object to be polished, an enhancement in polishing removal rate of an object to be polished, and a defect reduction on a surface of a polished object. The present disclosure relates to a polishing composition containing (A) an amine compound having a heterocyclic structure containing two or more nitrogen atoms, and (B) a water-soluble polymer, in which the content mass ratio of the component (A) to the component (B) (component (A)/component (B)) is 1 or more, the polishing composition has a pH of 8 or more, and the polishing composition is substantially free of an abrasive grain.

Dependencies are inferred from the claim text.