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US 2026/0286187 A1Published application
Slurry that suppresses reduction of lifetime of polishing pad and method for evaluating damage caused by slurry to polishing pad
OwnerEmi Naritainventor
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Abstract
An object to be solved by the present invention is to provide a technique for suppressing the short lifetime of a polishing pad with an approach completely different from conventionally known approaches. A slurry having a property of suppressing the wear amount of a polishing pad, as determined in Wear Amount Test X, to 0.037 mm3 or less.
Claims16
A slurry having a property of suppressing the wear amount of a polishing pad, as determined in Wear Amount Test X, to 0.037 mm3 or less.
A method for evaluating damage caused by a slurry to a polishing pad, comprising:
- a step of subjecting the slurry and the polishing pad to contact treatment to obtain a treated pad,
- a step of applying scratches to the treated pad using a static friction measuring machine, and
- a step of obtaining a wear amount value of the polishing pad from a volume of the scratches using a laser microscope.
Dependencies are inferred from the claim text.