B81C 99/008
Separating the processed structure from a mother substrate
Official title: {separating the processed structure from a mother substrate}
B81C99/008 (Separating the processed structure from a mother substrate) appears on 86 US grants and 96 published applications in this corpus.
Search patents in B81C- Granted patents
- 86
- Published applications
- 96
- Assignees
- 69
- Inventors
- 222
- Latest grant
- 30 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 1 | 0 |
| 2000 | 0 | 0 |
| 2001 | 2 | 3 |
| 2002 | 0 | 3 |
| 2003 | 2 | 4 |
| 2004 | 3 | 8 |
| 2005 | 3 | 4 |
| 2006 | 5 | 3 |
| 2007 | 4 | 7 |
| 2008 | 5 | 7 |
| 2009 | 4 | 6 |
| 2010 | 5 | 8 |
| 2011 | 1 | 2 |
| 2012 | 2 | 1 |
| 2013 | 6 | 6 |
| 2014 | 4 | 4 |
| 2015 | 5 | 5 |
| 2016 | 5 | 5 |
| 2017 | 4 | 4 |
| 2018 | 6 | 7 |
| 2019 | 8 | 5 |
| 2020 | 1 | 0 |
| 2021 | 5 | 1 |
| 2022 | 2 | 1 |
| 2023 | 1 | 0 |
| 2024 | 0 | 2 |
| 2025 | 0 | 0 |
| 2026 | 1 | 0 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Inattentive HF concentration vapors phase release of micro-electro-mechanical systems and optical systems30 Jun 2026US 12,668,485 B2UNM Rainforest Innovations
- Three-dimensional features formed in molded panel7 Nov 2023US 11,807,523 B2Hewlett-Packard Development Company, L. P.
- Method for manufacturing a timepiece component12 Jul 2022US 11,385,596 B2Rolex SA
- Processing method for wafer26 Apr 2022US 11,315,821 B2Disco Corporation
- Three-dimensional features formed in molded panel19 Oct 2021US 11,148,942 B2Hewlett-Packard Development Company, L. P.
- Mechanically compliant nanofibrous barrier6 Jun 2024US 2024/0181401 A1Infineon Technologies AG
- Inattentive HF Concentration Vapors Phase Release of Micro-electro-mechanical Systems and Optical Systems2 May 2024US 2024/0140786 A1UNM Rainforest Innovations
- Three-dimensional features formed in molded panel6 Jan 2022US 2022/0002149 A1Hewlett-Packard Development Company, L. P.
- Processing method for wafer4 Mar 2021US 2021/0066111 A1Disco Corporation
- Device and methods for the transfer of chips from a source substrate onto a destination substrate26 Dec 2019US 2019/0393201 A1Commissariat A L' Energie Atomique Et Aux Energies Alternatives
Most cited
By later US patents
- Methods of making, positioning and orienting nanostructures, nanostructure arrays and nanostructure devices234US 6,962,823 B2Nanosys, Inc. · 2005
- Methods of positioning and/or orienting nanostructures233US 6,872,645 B2Nanosys, Inc. · 2005
- Method of making a product with a micro or nano sized structure and product158US 7,531,120 B2Aquamarijn Holding B.V. · 2009
- Fabrication of single-crystal silicon structures using sacrificial-layer wafer bonding146US 5,882,532 AHewlett-Packard Company · 1999
- Systems and methods for controlling release of transferable semiconductor structures132US 9,601,356 B2X-Celeprint Limited · 2017