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US 11,807,523 B2Granted
Three-dimensional features formed in molded panel
AssigneeHewlett-Packard Development Company, L.P.
InventorsChien-Hua Chen, Devin A. Mourey, Michael G. Groh
Life of this patent
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Abstract
Examples include a device comprising integrated circuit dies molded into a molded panel. The molded panel has three-dimensional features formed therein, where the three-dimensional features are associated with the integrated circuit dies. To form the three-dimensional features, a feature formation material is deposited, the molded panel is formed, and the feature formation material is removed.
Claims15
An apparatus comprising:
- a molded panel having three-dimensional features formed therein, the molded panel including a first surface;
- at least one integrated circuit die molded into the first surface of the molded panel and associated with the three-dimensional features of the molded panel;
- at least one conductive trace electrically connected to the integrated circuit die and disposed in the molded panel;
- and
- a connection point electrically connected to a controller, the connection point disposed onto the first surface of the molded panel.
2 more elements
An apparatus comprising:
- a molded panel including a first surface, the molded panel having three-dimensional features formed therein, the three-dimensional features corresponding to a fluid communication channel, the three-dimensional features formed by removal of a three-dimensional feature formation material deposited in the molded panel;
- a fluid ejection die molded in the first surface of the molded panel, the fluid ejection die comprising a plurality of nozzles to eject printing material, the fluid ejection die having fluid feed holes in fluid communication with the plurality of nozzles, and the fluid feed holes in fluid communication with the fluid communication channel;
- a conductive trace electrically connected to the fluid ejection die, the conductive trace comprising a first portion passing through the molded panel;
- and
- a connection point electrically connected to a controller, the connection point disposed on the first surface of the molded panel.
2 more elements
An apparatus comprising:
- a molded panel comprising an epoxy mold compound and a first surface, the molded panel having three-dimensional features formed therein, the three-dimensional features formed by removal of a three-dimensional feature formation material deposited in the molded panel;
- a plurality of fluid ejection dies molded in the first surface of the molded panel, the plurality of fluid ejection dies comprising a plurality of nozzles to eject printing material, the plurality of fluid ejection dies having fluid feed holes in fluid communication with the plurality of nozzles;
- and
- a connection point electrically connected to a controller, the connection point disposed on the first surface of the molded panel.
1 more element
Dependencies are inferred from the claim text.