Three-dimensional features formed in molded panel

A process comprising:

• arranging a plurality of integrated circuit dies on a carrier;
• depositing a feature formation material on:
• a portion of an integrated circuit die of the plurality of integrated circuit dies, the carrier, or a combination thereof;
• forming a molded panel comprising an epoxy mold compound, the molded panel including the plurality of integrated circuit dies and the feature formation material therein;
• and
• removing the feature formation material from the molded panel to thereby form three-dimensional features in the molded panel, the three-dimensional features associated with the plurality of integrated circuit dies;
• wherein the plurality of integrated circuit dies are fluid ejection dies, each fluid ejection die comprises a plurality of nozzles, and wherein the removing the feature formation material forms the three-dimensional features in the molded panel corresponding to fluid communication channels that are in fluid communication with the nozzles of the fluid ejection dies, and the molded panel including the fluid ejection dies and having the fluid communication channels formed therein is a fluid ejection device.