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AssigneeX-Celeprint Limited
InventorsChristopher Bower, Matthew Meitl
Estimating the term…
The disclosed technology relates generally to methods and systems for controlling the release of micro devices. Prior to transferring micro devices to a destination substrate, a native substrate is formed with micro devices thereon. The micro devices can be distributed over the native substrate and spatially separated from each other by an anchor structure. The anchors are physically connected/secured to the native substrate. Tethers physically secure each micro device to one or more anchors, thereby suspending the micro device above the native substrate. In certain embodiments, single tether designs are used to control the relaxation of built-in stress in releasable structures on a substrate, such as Si (1 1 1). Single tether designs offer, among other things, the added benefit of easier break upon retrieval from native substrate in micro assembly processes. In certain embodiments, narrow tether designs are used to avoid pinning of the undercut etch front.
An array of micro devices, the array comprising:
A method of making thin and low-cost wafer-packaged micro-scale devices suitable for micro transfer printing using a (111) Silicon system, the method comprising:
Dependencies are inferred from the claim text.