B81C 3/005
Passive alignment, i.e. without a detection of the position of the elements
Official title: {Passive alignment, i.e. without a detection of the position of the elements or using only structural arrangements or thermodynamic forces}
B81C3/005 (Passive alignment, i.e. without a detection of the position of the elements) appears on 53 US grants and 64 published applications in this corpus.
Search patents in B81C- Granted patents
- 53
- Published applications
- 64
- Assignees
- 42
- Inventors
- 168
- Latest grant
- 28 Apr 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1994 | 1 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 1 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 1 |
| 2003 | 1 | 2 |
| 2004 | 1 | 1 |
| 2005 | 2 | 1 |
| 2006 | 1 | 0 |
| 2007 | 1 | 1 |
| 2008 | 2 | 3 |
| 2009 | 0 | 3 |
| 2010 | 2 | 2 |
| 2011 | 0 | 1 |
| 2012 | 0 | 4 |
| 2013 | 3 | 3 |
| 2014 | 3 | 5 |
| 2015 | 4 | 4 |
| 2016 | 3 | 3 |
| 2017 | 2 | 3 |
| 2018 | 5 | 9 |
| 2019 | 6 | 6 |
| 2020 | 4 | 3 |
| 2021 | 4 | 0 |
| 2022 | 2 | 3 |
| 2023 | 1 | 2 |
| 2024 | 2 | 1 |
| 2025 | 1 | 3 |
| 2026 | 1 | 0 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Die stacking with controlled angular alignment28 Apr 2026US 12,612,306 B2STMicroelectronics International N. V.
- Bonding process for forming semiconductor device structure25 Mar 2025US 12,258,265 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Microelectronics H-frame device22 Oct 2024US 12,122,666 B2Northrop Grumman Systems Corporation
- Watch component, watch movement and watch12 Mar 2024US 11,927,916 B2Seiko Epson Corporation
- Bonding process for forming semiconductor device structure3 Oct 2023US 11,772,963 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Bonding process for forming semiconductor device structure12 Jun 2025US 2025/0187907 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Methods of fabricating micro electro-mechanical systems structures22 May 2025US 2025/0162860 A1The University of British Columbia
- Method for fabricating a microelectronics h-frame device9 Jan 2025US 2025/0011160 A1Northrop Grumman Systems Corporation
- Die stacking with controlled angular alignment26 Dec 2024US 2024/0425367 A1NXP USA, Inc.
- Chip assembly and method of making a chip assembly14 Dec 2023US 2023/0400788 A1Npl Management Limited
Most cited
By later US patents
- Methods of making, positioning and orienting nanostructures, nanostructure arrays and nanostructure devices234US 6,962,823 B2Nanosys, Inc. · 2005
- Methods of positioning and/or orienting nanostructures233US 6,872,645 B2Nanosys, Inc. · 2005
- Method and apparatus for the assembly of microfabricated devices153US 5,355,577 A1994
- Microfluidic structure assembly with mating microfeatures113US 5,932,315 AHewlett-Packard Company · 1999
- Methods of making, positioning and orienting nanostructures, nanostructure arrays and nanostructure devices83US 7,151,209 B2Nanosys, Inc. · 2006