B81C 2203/0764
Forming the micromechanical structure in a groove
B81C2203/0764 (Forming the micromechanical structure in a groove) appears on 11 US grants and 12 published applications in this corpus.
Search patents in B81C- Granted patents
- 11
- Published applications
- 12
- Assignees
- 5
- Inventors
- 17
- Latest grant
- 25 Dec 2018
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2014 | 0 | 2 |
| 2015 | 1 | 2 |
| 2016 | 5 | 4 |
| 2017 | 4 | 3 |
| 2018 | 1 | 1 |
By publication year.
Recent patents
- Two-port SRAM connection structure25 Dec 2018US 10,163,495 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Multi-faced component-based electromechanical device11 Jul 2017US 9,701,532 B2International Business Machines Corporation
- Multi-faced component-based electromechanical device20 Jun 2017US 9,685,611 B2International Business Machines Corporation
- Two-port SRAM connection structure6 Jun 2017US 9,672,903 B2Taiwan Semicondutor Manufacturing Co.
- Multi-faced component-based electromechanical device16 May 2017US 9,650,242 B2International Business Machines Corporation
- Two-Port SRAM Connection Structure1 Mar 2018US 2018/0061487 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Multi-faced component-based electromechanical device23 Mar 2017US 2017/0081172 A1International Business Machines Corporation
- Multi-faced component-based electromechanical device23 Mar 2017US 2017/0081182 A1International Business Machines Corporation
- Multi-faced component-based electromechanical device23 Mar 2017US 2017/0084837 A1International Business Machines Corporation
- Two-Port SRAM Connection Structure22 Dec 2016US 2016/0372182 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Two-port SRAM connection structure18US 9,672,903 B2Taiwan Semicondutor Manufacturing Co. · 2017
- Systems and methods for horizontal integration of acceleration sensor structures7US 9,330,929 B1Infineon Technologies Dresden GmbH · 2016
- Two-port SRAM connection structure4US 10,163,495 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2018
- MEMS device with a capping substrate3US 9,511,997 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Electronic device, method for producing the same, and oscillator2US 9,190,954 B2Seiko Epson Corporation · 2015