Two-Port SRAM Connection Structure
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorJhon Jhy Liaw
Life of this patent
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Abstract
A static random access memory (SRAM) device is provided in accordance with some embodiments. The SRAM device comprises a plurality of two-port SRAM arrays, which comprise a plurality of two-port SRAM cells. Each two-port SRAM cell comprises a write port portion, a read port portion, a first plurality of metal lines located in a first metal layer, a second plurality of metal lines located in a second metal layer, a third plurality of metal lines located in a third metal layer a plurality of edge cells, a plurality of well strap cells, and a plurality of jumper structures. Each jumper structure comprises first, second, and third metal landing pads located in the second metal layer and electrically connecting metal lines of the first and third metal layers.
Claims20
A static random access memory (SRAM) device comprising:
- a peripheral logic circuit;
- a plurality of two-port SRAM cells, each two-port SRAM cell comprising:
- a write port portion including a first plurality of transistors;
- and
- a read port portion including a second plurality of transistors;
- a first plurality of metal lines including a write bit line, an inverse write bit line, a read bit line, a write word line landing pad, and a read word line landing pad, wherein the first plurality of metal lines is located in a first metal layer;
- a second plurality of metal lines including a write word line, wherein the second plurality of metal lines is located in a second metal layer;
- a third plurality of metal lines including a global write bit line and an inverse global write bit line, wherein the third plurality of metal lines is located in a third metal layer;
- and
- a plurality of jumper structures, each jumper structure comprising:
- a first metal landing pad located in the second metal layer and electrically connected to the write bit line and to the global write bit line;
- a second metal landing pad located in the second metal layer and electrically connected to the inverse write bit line and the inverse global write bit line;
- and
- a third metal landing pad located in the second metal layer and electrically connected to the read bit line and a peripheral metal line of the peripheral logic circuit, the peripheral metal line located in the first metal layer.
A static random access memory (SRAM) device comprising:
- a peripheral logic circuit;
- a first sub array and a second sub array, the first and second sub arrays each comprising:
- a plurality of two-port SRAM cells, each two-port SRAM cell comprising:
- a write port portion including a first plurality of transistors;
- and
- a read port portion including a second plurality of transistors;
- a first plurality of metal lines including a write bit line, an inverse write bit line, a read bit line, a write word line landing pad, and a read word line landing pad, wherein the first plurality of metal lines is located in a first metal layer;
- a second plurality of metal lines including a write word line, wherein the second plurality of metal lines is located in a second metal layer;
- and
- a third plurality of metal lines including a global write bit line and an inverse global write bit line, wherein the third plurality of metal lines is located in a third metal layer;
- wherein the write bit line, the inverse write bit line, the global write bit line, and the inverse global write bit line each have a routing length across the first and second sub arrays, and
- wherein the read bit line of the first sub array and the read bit line of the second sub array are physically isolated;
- and
- a plurality of jumper structures, each jumper structure comprising:
- a first metal landing pad located in the second metal layer and electrically connected to the write bit line and to the global write bit line;
- a second metal landing pad located in the second metal layer and electrically connected to the inverse write bit line and the inverse global write bit line;
- and
- a third metal landing pad located in the second metal layer and electrically connected to the read bit line and a peripheral metal line of the peripheral logic circuit, the peripheral metal line located in the first metal layer.
A static random access memory (SRAM) device comprising:
- a peripheral logic circuit;
- a first sub array and a second sub array, the first and second sub arrays each comprising:
- a plurality of two-port SRAM cells, each two-port SRAM cell comprising:
- a write port portion including a first plurality of transistors;
- and
- a read port portion including a second plurality of transistors;
- a first plurality of metal lines including a write bit line, an inverse write bit line, a read bit line, a write word line landing pad, and a read word line landing pad, wherein the first plurality of metal lines is located in a first metal layer;
- a second plurality of metal lines including a write word line, wherein the second plurality of metal lines is located in a second metal layer;
- and
- a third plurality of metal lines including a global write bit line, an inverse global write bit line, and a global read bit line, wherein the third plurality of metal lines is located in a third metal layer,
- wherein the write bit line, the inverse write bit line, the global write bit line, the inverse global write bit line, and the global read bit line each have a routing length across the first and second sub arrays, and
- wherein the read bit line of the first sub array and the read bit line of the second sub array are physically isolated;
- and
- a plurality of jumper structures, each jumper structure comprising:
- a first metal landing pad located in the second metal layer and electrically connected to the write bit line and to the global write bit line;
- a second metal landing pad located in the second metal layer and electrically connected to the inverse write bit line and the inverse global write bit line;
- and
- a third metal landing pad located in the second metal layer and electrically connected to the read bit line and a peripheral metal line of the peripheral logic circuit, the peripheral metal line located in the first metal layer.
Dependencies are inferred from the claim text.