B81C 2203/0181
Using microheaters for bonding the lid
B81C2203/0181 (Using microheaters for bonding the lid) appears on 15 US grants and 13 published applications in this corpus.
Search patents in B81C- Granted patents
- 15
- Published applications
- 13
- Assignees
- 10
- Inventors
- 22
- Latest grant
- 13 Sep 2022
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2000 | 1 | 0 |
| 2001 | 2 | 1 |
| 2002 | 1 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 2 |
| 2005 | 0 | 2 |
| 2006 | 0 | 1 |
| 2007 | 1 | 1 |
| 2008 | 2 | 0 |
| 2009 | 1 | 1 |
| 2010 | 1 | 0 |
| 2011 | 1 | 0 |
| 2012 | 0 | 2 |
| 2013 | 0 | 0 |
| 2014 | 0 | 0 |
| 2015 | 1 | 0 |
| 2016 | 0 | 0 |
| 2017 | 0 | 2 |
| 2018 | 1 | 0 |
| 2019 | 1 | 1 |
| 2020 | 1 | 0 |
| 2021 | 0 | 0 |
| 2022 | 1 | 0 |
By publication year. Applications have been published since 2001.
Recent patents
- Packaging techniques for electronic devices13 Sep 2022US 11,445,628 B1Verily Life Sciences LLC
- Process for encapsulation of a microelectronic device by easily manipulated thin or ultrathin substrates15 Dec 2020US 10,865,104 B2Commissariat A L' Energie Atomique Et Aux Energies Alternatives
- Laser reseal including a protective structure22 Jan 2019US 10,183,861 B2Robert Bosch GmbH
- Targeted control of the absorption behavior during laser resealing13 Mar 2018US 9,914,640 B2Robert Bosch GmbH
- Microelectromechanical device packages with integral heaters16 Jun 2015US 9,056,764 B2Texas Instruments Incorporated
- Process for encapsulation of a microelectronic device by easily manipulated thin or ultrathin substrates1 Aug 2019US 2019/0233281 A1Commissariat A L' Energie Atomique Et Aux Energies Alternatives
- Laser reseal including a protective structure8 Jun 2017US 2017/0158497 A1Robert Bosch GmbH
- Targeted control of the absorption behavior during laser resealing8 Jun 2017US 2017/0158498 A1Robert Bosch GmbH
- Microelectromechanical Device Packages with Integral Heaters19 Jul 2012US 2012/0180949 A1Texas Instruments Incorporated
- Covering Device for an Organic Substrate, Substrate with a Covering Device, and Method for Producing a Covering Device12 Apr 2012US 2012/0085750 A1Dyconex AG
Most cited
By later US patents
- Process for making microstructures and microstructures made thereby196US 6,232,150 B1The Regents of the University of Michigan · 2001
- Microstructures75US 6,436,853 B1University of Michigan · 2002
- Hermetically sealed transducer and methods for producing the same31US 6,326,682 B1Kulite Semiconductor Products, Inc. · 2001
- Microelectromechanical device packages with integral heaters18US 7,449,773 B2Texas Instruments Incorporated · 2008
- Microelectromechanical device packages with integral heaters17US 7,282,393 B2Texas Instruments Incorporated · 2007