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US 7,282,393 B2Granted
Microelectromechanical device packages with integral heaters
AssigneeTexas Instruments Incorporated
InventorTerry Tarn
Life of this patent
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Abstract
A microelectromechanical device package with integral a heater and a method for packaging the microelectromechanical device are disclosed in this invention. The microelectromechanical device package comprises a first package substrate and second substrate, between which a microelectromechanical device, such as a micromirror array device is located. In order to bonding the first and second package substrates so as to package the microelectromechanical device inside, a sealing medium layer is deposited, and heated by the heater so as to bond the first and second package substrates together.
Claims35
A method comprising:
- providing a first substrate that is ceramic and comprises a heater laminated between first and second ceramic layers of the first ceramic substrate;
- attaching a silicon substrate having formed thereon a microelectromechanical device to the first substrate;
- placing a second substrate on the first substrate with a first sealing medium layer therebetween;
- driving an electric current through the heater so as to generate heat for melting the first sealing medium;
- bonding the first and second substrate by the melted first sealing medium;
- placing the semiconductor device or the microelectromechanical device into a cavity defined by the first substrate;
- depositing an anti-stiction material within the cavity;
- forming another heater on in the second substrate such that the heater is along a periphery of one surface of the second substrate;
- and
- driving another electric current through the heater on the second substrate.
7 more elements
Dependencies are inferred from the claim text.