Targeted control of the absorption behavior during laser resealing

A method for manufacturing a micromechanical component, which includes a substrate and a cap, which is connected to the substrate and which, together with the substrate, encloses a first cavity, a first pressure prevailing and a first gas mixture having a first chemical composition being enclosed in the first cavity, the method comprising:

• forming, in a first task, an access opening connecting the first cavity to surroundings of the micromechanical component in the substrate or in the cap;
• adjusting, in a second task, the first pressure and/or the first chemical composition in the first cavity;
• and
• sealing, in a third task, the access opening by introducing energy or heat into an absorbing part of the substrate or the cap, with a laser;
• wherein the introduction of the energy or heat takes place by adjusting the extension of the absorbing part and by adjusting the absorption strength in the absorbing part to minimize stresses occurring in the substrate or in the cap.