Laser reseal including a protective structure

A method for manufacturing a micromechanical component including a substrate and a cap connected to the substrate, the cap, together with the substrate, enclosing a first cavity, a first pressure prevailing and a first gas mixture having a first chemical composition being enclosed in the first cavity, the method comprising:

• in a first method step, forming in the substrate or the cap an access opening connecting the first cavity to surroundings of the micromechanical component;
• in a second method step, adjusting in the first cavity at least one of the first pressure and the first chemical composition;
• in a third method step, sealing the access opening (by introducing energy or heat into an absorbing part of the substrate or the cap, with the aid of a laser;
• and
• in a fourth method step, applying, depositing or growing a layer for protecting the sealed access opening on a material area, which transitions into a liquid aggregate state in the third method step and transitions into a solid aggregate state after the third method step and which seals the access opening.