Covering Device for an Organic Substrate, Substrate with a Covering Device, and Method for Producing a Covering Device

A method for producing a covering device for covering an area of an organic substrate, with a connecting zone between a closure cap and the substrate, wherein the connecting zone comprises, at least in certain areas, a heating element for heating the connecting zone during creation of a connection between the closure cap and the substrate, the method comprising the following steps:

• providing an organic substrate with an area to be covered, with a connecting zone between the substrate and a closure cap, wherein the connecting zone has a heating element, at least in certain areas;
• placing the closure cap onto the area to be covered, wherein edges of the closure cap correspond with a path of the heating element;
• activating the heating element for heating the connecting zone;
• and
• creating a connection between the closure cap and the substrate in the connecting zone.