Packaging techniques for electronic devices
AssigneeVerily Life Sciences LLC
InventorsJeff Clarkson, Roseann Ahlin
Life of this patent
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Abstract
One disclosed method includes defining an electrical trace on a first substrate; physically coupling an electronic component to the first substrate, wherein a portion of the electrical trace completely encircles the electronic component; overlaying a second substrate onto the first substrate, the overlaying causing the second substrate to completely cover the portion of the electrical trace and the electronic component; electrically coupling an electrical power source to the electrical trace to generate a current in the electrical trace; melting the second substrate using heat generated by the current through the electrical trace; and fusing the second substrate to the first substrate to generate a hermetic seal around the electronic component.
Claims18
A method comprising:
- defining an electrical trace on a first substrate;
- physically coupling an electronic component to the first substrate, wherein a portion of the electrical trace encircles a portion of the first substrate having the electronic component;
- overlaying a second substrate onto the first substrate, the overlaying causing the second substrate to cover the portion of the electrical trace, the electronic component, and the portion of the first substrate;
- electrically coupling an electrical power source to the electrical trace to generate a current in the electrical trace;
- melting the second substrate using heat generated by the current through the electrical trace;
- and
- fusing the melted second substrate to the first substrate to generate a hermetic seal around the portion of the first substrate and the electronic component.
A device comprising:
- a first substrate;
- an electronic component coupled to the first substrate;
- an electrical trace disposed on the first substrate, a portion of the electrical trace encircling a portion of the first substrate having the electronic component;
- and
- a second substrate positioned over the portion of the first substrate, the electronic component, and the portion of the electrical trace, the second substrate bonded to the first substrate based on a melting of the second substrate caused by heating of the portion of the electrical trace from an electrical current through the portion of the electrical trace from an electrical power source.
Dependencies are inferred from the claim text.