Microelectromechanical Device Packages with Integral Heaters
AssigneeTexas Instruments Incorporated
InventorTerry Tarn
Life of this patent
Estimating the term…
Abstract
A microelectromechanical device package with integral a heater and a method for packaging the microelectromechanical device are disclosed in this invention. The microelectromechanical device package comprises a first package substrate and second substrate, between which a microelectromechanical device, such as a micromirror array device is located. In order to bonding the first and second package substrates so as to package the microelectromechanical device inside, a sealing medium layer is deposited, and heated by the heater so as to bond the first and second package substrates together.
Claims28
1-55. (canceled)
A method comprising:
- providing a first substrate of a microelectromechanical device;
- attaching the first substrate to a second substrate;
- bonding the second substrate to a third substrate with a solder material so as to enclose the device within a space between the bonded second and third substrates.
A method comprising:
- providing a packaging substrate including a cavity and an upper surface surrounding the cavity;
- a heater formed integrally with the packaging substrate peripherally surrounding the cavity and proximate the upper surface;
- and a MEMS device located within the cavity;
- bonding a lower surface of a cover substrate to the upper surface of the packaging substrate to hermetically seal the MEMS device within the cavity;
- wherein the bonding comprises applying a sealing medium to at least one of the upper surface and the lower surface;
- and heating the sealing medium with the heater to a melting temperature of the sealing medium, to bond the cover substrate to the packaging substrate without raising the MEMS device to the melting temperature.
A method comprising:
- providing a packaging substrate including a cavity and an upper surface surrounding the cavity;
- and a MEMS device located within the cavity;
- providing a cover substrate having a lower surface;
- providing a heater formed integrally with at least one of:
- a) the packaging substrate peripherally surrounding the cavity and proximate the upper surface, or b) the cover substrate proximate a periphery of the lower surface;
- bonding the lower surface to the upper surface to hermetically seal the MEMS device within the cavity;
- wherein the bonding comprises applying a sealing medium to at least one of the upper surface and the lower surface;
- and heating the sealing medium with the heater to a melting temperature of the sealing medium, to bond the cover substrate to the packaging substrate without raising the MEMS device to the melting temperature.
Dependencies are inferred from the claim text.