B81C 2201/0116
Thermal treatment for structural rearrangement of substrate atoms
Official title: Thermal treatment for structural rearrangement of substrate atoms, e.g. for making buried cavities
B81C2201/0116 (Thermal treatment for structural rearrangement of substrate atoms) appears on 53 US grants and 68 published applications in this corpus.
Search patents in B81C- Granted patents
- 53
- Published applications
- 68
- Assignees
- 26
- Inventors
- 119
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2002 | 1 | 2 |
| 2003 | 0 | 0 |
| 2004 | 0 | 2 |
| 2005 | 0 | 1 |
| 2006 | 1 | 1 |
| 2007 | 1 | 3 |
| 2008 | 0 | 2 |
| 2009 | 3 | 2 |
| 2010 | 4 | 2 |
| 2011 | 1 | 1 |
| 2012 | 1 | 4 |
| 2013 | 2 | 3 |
| 2014 | 4 | 1 |
| 2015 | 4 | 3 |
| 2016 | 0 | 3 |
| 2017 | 2 | 4 |
| 2018 | 4 | 6 |
| 2019 | 4 | 8 |
| 2020 | 7 | 5 |
| 2021 | 4 | 4 |
| 2022 | 4 | 2 |
| 2023 | 2 | 3 |
| 2024 | 3 | 1 |
| 2025 | 0 | 1 |
| 2026 | 1 | 4 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Micromechanical arm array for mems actuators8 Sep 2026US 12,729,109 B2Taiwan Semiconductor Manufacturing Company.Ltd
- MEMS device having an improved stress distribution and manufacturing process thereof10 Sep 2024US 12,084,341 B2STMicroelectronics S,r.l.
- Semiconductor integrated device with electrical contacts between stacked dies and corresponding manufacturing process2 Jul 2024US 12,024,422 B2STMicroelectronics S,r.l.
- MEMS microphone and preparation method therefor25 Jun 2024US 12,022,270 B2Csmc Technologies Fab2 Co., Ltd.
- Micro-electro-mechanical system (MEMS) thermal sensor24 Oct 2023US 11,796,396 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Micromechanical arm array for mems actuators8 Oct 2026US 2026/0307981 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Mems device with compensation of the mechanical stress and related manufacturing process4 Jun 2026US 2026/0152384 A1STMicroelectronics International N. V.
- Method of manufacturing a layered structure for a mems apparatus and mems apparatus having such a layered structure26 Feb 2026US 2026/0054980 A1OQmented GmbH
- Method for making a hollow structure, and micromechanical sensor having such a hollow structure12 Feb 2026US 2026/0042663 A1
- Micromechanical arm array for mems actuators23 Oct 2025US 2025/0326630 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Method for manufacturing semiconductor pressure sensor having reference pressure chamber27US 6,495,389 B2Denso Corporation · 2002
- Process for manufacturing a membrane of semiconductor material integrated in, and electrically insulated from, a substrate19US 7,678,600 B2STMicroelectronics S,r.l. · 2010
- Micro-electro-mechanical device having two buried cavities and manufacturing process thereof12US 9,688,531 B2STMicroelectronics S,r.l. · 2017
- Process for manufacturing a micromechanical structure having a buried area provided with a filter10US 8,633,553 B2STMicroelectronics S,r.l. · 2014
- Method for producing micromechanic sensors and sensors produced by said method8US 7,045,382 B2Robert Bosch GmbH · 2006