Semiconductor integrated device with electrical contacts between stacked dies and corresponding manufacturing process

An electronic apparatus, comprising:

• a first die including an inertial sensor;
• a second die facing the first die in a first direction;
• a conductive structure arranged between facing surfaces of the first die and of the second die, and electrically and mechanically coupling to each of the first die and the second die;
• and
• a supporting element arranged at a facing surface of one of the first die or the second die and elastically coupling to the conductive structure.

A process, comprising:

• forming a cavity adjacent to a first surface of a first die, the cavity being covered by a first layer;
• forming an opening through the first layer, the opening exposing an edge portion of the cavity, the opening defining a first portion of the first layer that is a cantilever-shaped and extends at the first surface of a first die and over the cavity;
• and
• coupling the first die to a second die through an electrically conductive structure between the first portion of the first layer and the second die.