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US 7,045,382 B2Granted
Method for producing micromechanic sensors and sensors produced by said method
AssigneeRobert Bosch GmbH
InventorsHubert Benzel, Heribert Weber, Hans Artmann, Frank Schaefer
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Abstract
Proposed is a method for manufacturing micromechanical sensors and sensors manufactured by this method, where openings are introduced into a semiconductor substrate. After the openings are introduced into the semiconductor substrate, a subsequent temperature treatment is carried out, in which the openings are converted into voids in the depth of the substrate.
Claims9
A method for manufacturing a micromechanical sensor, comprising:
- introducing openings into a semiconductor substrate;
- subsequently performing a temperature treatment, wherein:
- geometric dimensions of the openings and a temperature duration and a time duration of the temperature treatment are selected in such a manner that a void forms in a depth of the semiconductor substrate;
- and
- providing a second layer above the semiconductor substrate, wherein a sensing region is formed by at least one of a region of the substrate above the void and a region of the second layer above the void.
2 more elements
Dependencies are inferred from the claim text.