B81C 1/00952
Treatments or methods for avoiding stiction during the manufacturing process not provided
Official title: {Treatments or methods for avoiding stiction during the manufacturing process not provided for in groups B81C1/00928 - B81C1/00944}
B81C1/00952 (Treatments or methods for avoiding stiction during the manufacturing process not provided) appears on 48 US grants and 52 published applications in this corpus.
Search patents in B81C- Granted patents
- 48
- Published applications
- 52
- Assignees
- 39
- Inventors
- 113
- Latest grant
- 1 Apr 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2000 | 1 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 1 |
| 2005 | 1 | 0 |
| 2006 | 0 | 2 |
| 2007 | 0 | 2 |
| 2008 | 1 | 2 |
| 2009 | 3 | 1 |
| 2010 | 2 | 1 |
| 2011 | 2 | 2 |
| 2012 | 2 | 2 |
| 2013 | 2 | 1 |
| 2014 | 1 | 5 |
| 2015 | 3 | 3 |
| 2016 | 3 | 2 |
| 2017 | 2 | 5 |
| 2018 | 4 | 9 |
| 2019 | 8 | 5 |
| 2020 | 5 | 5 |
| 2021 | 3 | 1 |
| 2022 | 3 | 0 |
| 2023 | 1 | 0 |
| 2024 | 0 | 2 |
| 2025 | 1 | 1 |
By publication year. Applications have been published since 2001.
Recent patents
- Method for manufacturing mirror device1 Apr 2025US 12,264,065 B2Hamamatsu Photonics K.K.
- Using sacrificial polymer materials in semiconductor processing16 May 2023US 11,651,952 B2Micron Technology, Inc.
- Method for forming MEMS cavity structure17 May 2022US 11,332,364 B1AAC Technologies PTE.Ltd.
- Fence structure to prevent stiction in a MEMS motion sensor1 Mar 2022US 11,261,083 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor device with patterned contact area25 Jan 2022US 11,230,470 B2InvenSense, Inc.
- Mems grating and fabrication method27 Feb 2025US 2025/0066188 A1Northwestern Polytechnical University
- Method for manufacturing mirror device21 Mar 2024US 2024/0092634 A1Hamamatsu Photonics K.K.
- Encapsulated mems device and method for manufacturing the mems device29 Feb 2024US 2024/0067520 A1Infineon Technologies AG
- Using sacrificial polymer materials in semiconductor processing27 May 2021US 2021/0159069 A1Micron Technology, Inc.
- Fence structure to prevent stiction in a mems motion sensor7 May 2020US 2020/0140265 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Ground strap for suppressing stiction during MEMS fabrication65US 7,544,531 B1SiTime Corporation · 2009
- Microelectromechanical system (MEMS) device and fabrication method thereof46US 9,126,827 B2Solid State System Co., Ltd. · 2015
- Method for the manufacturing of micromachined structures and a micromachined structure manufactured using such method26US 6,103,399 A2000
- Manufacturing method of a MEMS structure, a cantilever-type MEMS structure, and a sealed fluidic channel8US 7,456,041 B2Samsung Electronics Co., Ltd. · 2008
- Micro-mechanical structure and method for manufacturing the same8US 7,728,395 B2Electronics and Telecommunications Research Institute · 2010