B81C 1/0092
For avoiding stiction during the manufacturing process of the device
Official title: {For avoiding stiction during the manufacturing process of the device, e.g. during wet etching}
B81C1/0092 (For avoiding stiction during the manufacturing process of the device) appears on 157 US grants and 145 published applications in this corpus.
Search patents in B81C- Granted patents
- 157
- Published applications
- 145
- Assignees
- 103
- Inventors
- 377
- Latest grant
- 11 Nov 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1991 | 1 | 0 |
| 1992 | 0 | 0 |
| 1993 | 1 | 0 |
| 1994 | 3 | 0 |
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 7 | 0 |
| 1998 | 6 | 0 |
| 1999 | 1 | 0 |
| 2000 | 6 | 0 |
| 2001 | 7 | 2 |
| 2002 | 4 | 2 |
| 2003 | 5 | 9 |
| 2004 | 3 | 5 |
| 2005 | 5 | 7 |
| 2006 | 4 | 8 |
| 2007 | 6 | 9 |
| 2008 | 6 | 4 |
| 2009 | 3 | 4 |
| 2010 | 7 | 1 |
| 2011 | 3 | 4 |
| 2012 | 6 | 7 |
| 2013 | 4 | 5 |
| 2014 | 4 | 9 |
| 2015 | 8 | 8 |
| 2016 | 6 | 8 |
| 2017 | 5 | 6 |
| 2018 | 9 | 15 |
| 2019 | 9 | 7 |
| 2020 | 9 | 9 |
| 2021 | 5 | 2 |
| 2022 | 5 | 4 |
| 2023 | 4 | 3 |
| 2024 | 1 | 3 |
| 2025 | 3 | 3 |
| 2026 | 0 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- B81C 1/00952Treatments or methods for avoiding stiction during the manufacturing process not provided48
- B81C 1/00936Releasing the movable structure without liquid etchant39
- B81C 1/00928Eliminating or avoiding remaining moisture after the wet etch release of the33
- B81C 1/00944Maintaining a critical distance between the structures to be released29
Recent patents
- Extended acid etch for oxide removal11 Nov 2025US 12,466,727 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Method of manufacturing a microstructure15 Jul 2025US 12,358,784 B2Memsstar Limited
- Method for manufacturing mirror device1 Apr 2025US 12,264,065 B2Hamamatsu Photonics K.K.
- Anti-stiction process for MEMS device3 Dec 2024US 12,157,667 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Micro-electro-mechanical system (MEMS) thermal sensor24 Oct 2023US 11,796,396 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Anti-Stiction Process for Mems Device14 May 2026US 2026/0132019 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Method of manufacturing a microstructure23 Oct 2025US 2025/0326633 A1Memsstar Limited
- Method of manufacturing a microstructure23 Oct 2025US 2025/0326634 A1Memsstar Limited
- Mems grating and fabrication method27 Feb 2025US 2025/0066188 A1Northwestern Polytechnical University
- Inattentive HF Concentration Vapors Phase Release of Micro-electro-mechanical Systems and Optical Systems2 May 2024US 2024/0140786 A1UNM Rainforest Innovations
Most cited
By later US patents
- Process for producing surface micromechanical structures216US 5,683,591 ARobert Bosch GmbH · 1997
- Anhydrous HF release of process for MEMS devices201US 7,365,016 B2DALSA Semiconductor Inc. · 2008
- Manufacture of MEMS structures in sealed cavity using dry-release MEMS device encapsulation191US 7,008,812 B1IC Mechanics, Inc. · 2006
- Capacitive surface micromachined differential pressure sensor112US 5,332,469 AFord Motor Company · 1994
- Microstructure, process for manufacturing thereof and devices incorporating the same102US 5,658,698 ACanon Kabushiki Kaisha · 1997