B81C 1/00928
Eliminating or avoiding remaining moisture after the wet etch release of the
Official title: {Eliminating or avoiding remaining moisture after the wet etch release of the movable structure}
B81C1/00928 (Eliminating or avoiding remaining moisture after the wet etch release of the) appears on 33 US grants and 36 published applications in this corpus.
Search patents in B81C- Granted patents
- 33
- Published applications
- 36
- Assignees
- 38
- Inventors
- 123
- Latest grant
- 3 Dec 2024
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1991 | 1 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 1 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 2 | 0 |
| 1998 | 3 | 0 |
| 1999 | 0 | 0 |
| 2000 | 2 | 0 |
| 2001 | 2 | 1 |
| 2002 | 2 | 0 |
| 2003 | 0 | 2 |
| 2004 | 1 | 4 |
| 2005 | 1 | 2 |
| 2006 | 1 | 1 |
| 2007 | 1 | 2 |
| 2008 | 2 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 0 |
| 2011 | 1 | 0 |
| 2012 | 0 | 2 |
| 2013 | 0 | 2 |
| 2014 | 2 | 2 |
| 2015 | 3 | 3 |
| 2016 | 1 | 1 |
| 2017 | 1 | 1 |
| 2018 | 0 | 3 |
| 2019 | 1 | 3 |
| 2020 | 1 | 2 |
| 2021 | 0 | 0 |
| 2022 | 3 | 2 |
| 2023 | 0 | 1 |
| 2024 | 1 | 0 |
| 2025 | 0 | 1 |
| 2026 | 0 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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- Systems and methods for uniform target erosion magnetic assemblies19 Jul 2022US 11,390,520 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Anti-stiction process for MEMS device19 Apr 2022US 11,305,980 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor device with patterned contact area25 Jan 2022US 11,230,470 B2InvenSense, Inc.
- Substrate processing method and substrate processing apparatus7 Apr 2020US 10,615,026 B2SCREEN Holdings Co., Ltd.
- Anti-Stiction Process for Mems Device14 May 2026US 2026/0132019 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Mems grating and fabrication method27 Feb 2025US 2025/0066188 A1Northwestern Polytechnical University
- Use of a Composition Consisting of Ammonia and an Alkanol for Avoiding Pattern Collapse When Treating Patterned Materials with Line-Space Dimensions of 50 NM or Below27 Jul 2023US 2023/0235252 A1BASF SE
- Anti-stiction process for mems device4 Aug 2022US 2022/0242724 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Composition for avoiding pattern collapse when treating patterned materials with line-space dimensions of 50 nm or below comprising a boron-type additive16 Jun 2022US 2022/0187712 A1BASF SE
Most cited
By later US patents
- Method for fabricating microstructures92US 5,314,572 AAnalog Devices, Inc. · 1994
- Method for drying micromechanical components47US 5,700,379 ASiemens Aktiengesellschaft · 1997
- Semiconductor physical quantity sensor having movable portion and fixed portion confronted each other and method of manufacturing the same44US 6,276,207 B1Denso Corporation · 2001
- Formation of microstructures with removal of liquid by freezing and sublimation40US 5,013,693 AWisconsin Alumni Research Foundation · 1991
- Microelectromechanical device manufacturing process38US 6,337,027 B12002