Semiconductor device with patterned contact area
AssigneeInvenSense, Inc.
InventorIlya Gurin
Life of this patent
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Abstract
The present invention relates to semiconductor devices, such as microelectromechanical (MEMS) devices, with improved resilience during manufacturing. In one embodiment, a MEMS device includes a MEMS structure; a substrate situated parallel to the MEMS structure and positioned a first distance from the MEMS structure; and a bump stop structure formed on the substrate between the substrate and the MEMS structure, wherein the bump stop structure substantially traces a perimeter of the substrate, wherein the bump stop structure extends from the substrate to a second distance from the MEMS structure, and wherein the second distance is greater than zero and less than the first distance.
Claims15
A microelectromechanical system (MEMS) device, comprising:
- a MEMS structure comprising one or more non-moveable MEMS features;
- a substrate situated parallel to the MEMS structure and positioned a first distance from the MEMS structure;
- and
- a plurality of bump stop structures formed on the substrate between the substrate and the MEMS structure, wherein at least one of the plurality of bump stop structures extend from the substrate, and wherein at least a portion of the plurality of bump stop structures substantially trace a perimeter of the substrate, wherein an interior of the substrate comprises a first area and a second area, wherein the first area corresponds to the at least a portion of the plurality of bump stop structures and a first moveable portion of the MEMS device, wherein the second area corresponds to a second moveable portion of the MEMS device, and wherein a first stiffness of the first moveable portion in a direction normal to a plane of the substrate is higher than a second stiffness of the second moveable portion.
A microelectromechanical system (MEMS) device, comprising:
- a MEMS structure comprising one or more non-moveable MEMS features situated in an area of the MEMS structure;
- a substrate situated parallel to the MEMS structure and positioned a first distance from the MEMS structure, wherein the first distance is greater than zero;
- a recess formed in the substrate, wherein the recess is confined by a boundary region disposed along a perimeter of the substrate and an area of the substrate corresponding to the area in which the non-moveable MEMS features are situated, wherein the recess extends into the substrate to a second distance from the MEMS structure, and wherein the second distance is greater than the first distance;
- and
- a plurality of bump stops disposed along the boundary region, wherein an interior of the substrate comprises a first area and a second area, wherein the first area corresponds to the at least a portion of the plurality of bump stops and a first moveable portion of the MEMS device, wherein the second area corresponds to a second moveable portion of the MEMS device, and wherein a first stiffness of the first moveable portion in a direction normal to a plane of the substrate is higher than a second stiffness of the second moveable portion.
Dependencies are inferred from the claim text.