Composition for avoiding pattern collapse when treating patterned materials with line-space dimensions of 50 nm or below comprising a boron-type additive
AssigneeBASF SE
InventorsSzilard Csihony, Daniel Loeffler, Marcel Brill, Frank Pirrung, Lothar Engelbrecht, Maike Bergeler, Paatrick Wilke, Yeni Burk, Volodymyr Boyko
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Abstract
Described herein is a non-aqueous composition including (a) an organic solvent, and (b) at least one additive of formulae I, where R1, R2, R3, and R4 are independently selected from C1 to C10 alkyl, C1 to C11 alkylcarbonyl, C6 to C12 aryl, C7 to C14 alkylaryl, and C7 to C14 arylalkyl; and n is 0 or 1.
Claims16
A method of using a non-aqueous composition comprising
- (a) an organic solvent;
- and
- (b) at least one additive of formulae I;
- wherein R1, R2, R3, and R4 are independently selected from the group consisting of C1 to C10 alkyl, C1 to C11 alkylcarbonyl, C6 to C12 aryl, C7 to C14 alkylaryl, and C7 to C14 arylalkyl;
- and n is 0 or 1, the method comprising using the non-aqueous composition for treating substrates having patterned material layers having line-space dimensions of 50 nm or below, aspect ratios of greater or equal 4, or a combination thereof.
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A method for manufacturing integrated circuit devices, optical devices, micromachines and mechanical precision devices, the said method comprising the steps of
- (1) providing a substrate having patterned material layers having line-space dimensions of 50 nm or below, aspect ratios of greater or equal 4, or a combination thereof,
- (2) contacting the substrate at least once with a non-aqueous composition comprising
- (a) an organic solvent;
- and
- (b) at least one additive of formulae I;
- wherein R1, R2, R3, and R4 are independently selected from the group consisting of C1 to C10 alkyl, C1 to C11 alkylcarbonyl, C6 to C12 aryl, C7 to C14 alkylaryl, and C7 to C14 arylalkyl;
- and n is 0 or 1, and
- (3) removing the non-aqueous composition from the contact with the substrate.
Dependencies are inferred from the claim text.