B81C 1/00944
Maintaining a critical distance between the structures to be released
Official title: {Maintaining a critical distance between the structures to be released}
B81C1/00944 (Maintaining a critical distance between the structures to be released) appears on 29 US grants and 24 published applications in this corpus.
Search patents in B81C- Granted patents
- 29
- Published applications
- 24
- Assignees
- 24
- Inventors
- 44
- Latest grant
- 24 Oct 2023
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1993 | 1 | 0 |
| 1994 | 2 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 1 | 0 |
| 1998 | 2 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 1 | 0 |
| 2002 | 0 | 0 |
| 2003 | 1 | 1 |
| 2004 | 0 | 0 |
| 2005 | 1 | 1 |
| 2006 | 0 | 3 |
| 2007 | 2 | 4 |
| 2008 | 2 | 2 |
| 2009 | 0 | 2 |
| 2010 | 3 | 0 |
| 2011 | 0 | 2 |
| 2012 | 4 | 1 |
| 2013 | 1 | 1 |
| 2014 | 1 | 0 |
| 2015 | 1 | 0 |
| 2016 | 0 | 0 |
| 2017 | 0 | 1 |
| 2018 | 2 | 2 |
| 2019 | 1 | 1 |
| 2020 | 1 | 1 |
| 2021 | 1 | 1 |
| 2022 | 0 | 0 |
| 2023 | 1 | 1 |
By publication year. Applications have been published since 2001.
Recent patents
- Micro-electro-mechanical system (MEMS) thermal sensor24 Oct 2023US 11,796,396 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Micro-electro-mechanical system (MEMS) thermal sensor30 Mar 2021US 10,962,424 B2Taiwan Semiconductor Manufacturing Company, Ltd.
- Method and apparatus for reducing in-process and in-use stiction for MEMS devices22 Dec 2020US 10,870,574 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Method and apparatus for reducing in-process and in-use stiction for MEMS devices30 Apr 2019US 10,273,143 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Process for producing an electromechanical device30 Oct 2018US 10,112,827 B2Commissariat A L' Energie Atomique Et Aux Energies Alternatives
- Micro-Electro-Mechanical System (Mems) Thermal Sensor23 Nov 2023US 2023/0375416 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Micro-electro-mechanical sytem (mems) thermal sensor15 Jul 2021US 2021/0215550 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Micro-electro-mechanical system (mems) thermal sensor2 Apr 2020US 2020/0103290 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Method and apparatus for reducing in-process and in-use stiction for mems devices8 Aug 2019US 2019/0241425 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Process for producing an electromechanical device31 May 2018US 2018/0148328 A1Commissariat A L' Energie Atomique Et Aux Energies Alternatives
Most cited
By later US patents
- Capacitive surface micromachined differential pressure sensor112US 5,332,469 AFord Motor Company · 1994
- Method for fabricating microstructures using temporary bridges52US 5,364,497 AAnalog Devices, Inc. · 1994
- Dry-release method for sacrificial layer microstructure fabrication36US 5,258,097 AFord Motor Company · 1993
- System and method of providing a regenerating protective coating in a MEMS device30US 7,446,926 B2Idc, LLC · 2008
- Method of HF vapor release of microstructures27US 6,238,580 B1The Aerospace Corporation · 2001