Method and apparatus for reducing in-process and in-use stiction for MEMS devices

A Micro-Electro-Mechanical System (MEMS) device, comprising:

• a first substrate;
• a cavity formed in the first substrate;
• and
• a second substrate bonded to the first substrate, wherein the second substrate includes a plurality of movable MEMS components that are located over the cavity;
• wherein:
• the movable MEMS components each extend in a first direction and are spaced apart from one another in a second direction different from the first direction;
• each of the movable MEMS components includes a plurality of segments that protrude toward the cavity;
• and
• the segments are spaced apart from one another by a plurality of trenches, wherein each of the trenches include opposing side surfaces joined by a connecting surface, wherein the connecting surface faces the cavity.

An apparatus, comprising:

• a Micro-Electro-Mechanical System (MEMS) device, wherein the MEMS device includes:
• a first substrate, wherein the first substrate includes a cavity;
• and
• a second substrate bonded to the first substrate, wherein the second substrate includes a plurality of movable components disposed over the cavity, wherein the movable components are hinged vertically and each contain a plurality of protrusions that protrude toward the cavity.