Manufacturing method of a MEMS structure, a cantilever-type MEMS structure, and a sealed fluidic channel
AssigneeSamsung Electronics Co., Ltd.
InventorsByeoung-ju Ha, Chang-seung Lee
Life of this patent
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Abstract
A method of manufacturing a MEMS structure including forming a porous layer having a predetermined thickness on the top surface of a substrate over an area where a cavity is to be formed; forming the cavity by etching the substrate below the porous layer; forming a membrane layer on the top surface to seal the cavity; and forming a structure on the upper side of the membrane layer. After forming a cantilever structure on the membrane layer and etching the membrane layer, a cantilever structure is produced in a floating state over the cavity. Also, at least one inlet hole and outlet hole can be formed in the porous layer and the membrane, thereby providing a sealed fluidic channel.
Claims12
A method of manufacturing a MEMS structure which comprises
- forming a trench in a P-type silicon substrate;
- forming an oxide film on the substrate including a barrier by embedding the trench with the oxide film;
- removing the oxide film formed on the substrate, except for the barrier embedded in the trench;
- forming a mask layer on the substrate where the oxide film has been removed and removing a portion corresponding to an inside of the barrier;
- forming a porous layer having a predetermined thickness on the upper side of the substrate corresponding to the inside of the barrier;
- etching the substrate below the porous layer to form a cavity;
- removing the mask layer formed outside the barrier;
- sealing the upper side of the cavity with a membrane layer;
- and
- forming a resonator structure on the upper side of the membrane layer.
Dependencies are inferred from the claim text.