B81C 1/00428
Etch mask forming processes not provided for in groups b81c1/00396 - b81c1/0042
Official title: {Etch mask forming processes not provided for in groups B81C1/00396 - B81C1/0042}
B81C1/00428 (Etch mask forming processes not provided for in groups b81c1/00396 - b81c1/0042) appears on 55 US grants and 58 published applications in this corpus.
Search patents in B81C- Granted patents
- 55
- Published applications
- 58
- Assignees
- 32
- Inventors
- 108
- Latest grant
- 5 May 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1997 | 1 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 1 |
| 2002 | 1 | 1 |
| 2003 | 3 | 1 |
| 2004 | 1 | 1 |
| 2005 | 0 | 0 |
| 2006 | 1 | 1 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 1 |
| 2011 | 0 | 0 |
| 2012 | 1 | 1 |
| 2013 | 0 | 2 |
| 2014 | 0 | 2 |
| 2015 | 3 | 3 |
| 2016 | 3 | 14 |
| 2017 | 3 | 14 |
| 2018 | 7 | 3 |
| 2019 | 20 | 3 |
| 2020 | 4 | 4 |
| 2021 | 3 | 1 |
| 2022 | 1 | 3 |
| 2023 | 1 | 1 |
| 2024 | 1 | 1 |
| 2025 | 0 | 0 |
| 2026 | 1 | 0 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Process for manufacturing a microelectromechanical mirror device and microelectromechanical mirror device5 May 2026US 12,619,065 B2STMicroelectronics S,r.l.
- Method for forming a trench in a first semiconductor layer of a multi-layer system17 Sep 2024US 12,094,717 B2Robert Bosch GmbH
- Segmented pedestal for mounting device on chip3 Jan 2023US 11,542,153 B2Taiwan Semiconductor Manufacturing Company.Ltd
- High-volume millimeter scale manufacturing10 May 2022US 11,325,828 B2Vibrant Composites Inc.
- Superhydrophobic and superoleophobic nanosurfaces17 Aug 2021US 11,090,903 B2The Regents of the University of California
- Method of fabricating molds for forming waveguides and related systems and methods using the waveguides31 Oct 2024US 2024/0359372 A1Magic Leap, Inc.
- Vertical mechanical stops to prevent large out-of-plane displacements of a micro-mirror and methods of manufacture4 May 2023US 2023/0136105 A1Calient Technologies, Inc.
- Process for manufacturing a microelectromechanical mirror device and microelectromechanical mirror device3 Nov 2022US 2022/0350134 A1STMicroelectronics S,r.l.
- High-volume millimeter scale manufacturing18 Aug 2022US 2022/0259038 A1Vibrant Composites Inc.
- Method for forming a trench in a first semiconductor layer of a multi-layer system21 Jul 2022US 2022/0230886 A1Robert Bosch GmbH
Most cited
By later US patents
- Methods for forming openings in a substrate and apparatuses with these openings and methods for creating assemblies with openings201US 6,479,395 B1Alien Technology Corporation · 2002
- Multi depth substrate fabrication processes113US 6,569,607 B2Caliper Technologies Corp. · 2003
- Sequential infiltration synthesis for advanced lithography93US 8,980,418 B2Uchicago Argonne, LLC · 2015
- Masking process for fabricating ultra-high aspect ratio, wafer-free micro-opto-electromechanical structures92US 5,628,917 ACornell Research Foundation, Inc. · 1997
- Methods for forming openings in a substrate and apparatuses with these openings and methods for creating assemblies with openings74US 7,101,502 B2Alien Technology Corporation · 2006