Multi depth substrate fabrication processes
AssigneeCaliper Technologies Corp.
InventorRichard J. McReynolds
Life of this patent
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AssigneeCaliper Technologies Corp.
InventorRichard J. McReynolds
Estimating the term…
Method of fabricating microstructures on a substrate. The method comprises providing a substrate layer having a first surface with a resist layer. First selected regions of the resist layer are exposed to an environment that renders the resist layer more or less soluble in a developer solution. The resist layer is then developed in the developer solution to expose selected regions of the substrate surface. Second selected regions of the resist layer are then exposed to an environment that renders the resist layer more or less soluble in the developer solution by aligning exposure of the second selected regions to the first selected regions. The first selected regions of the substrate surface are etched. Second selected regions of the resist layer are then developed to expose the second selected regions of the substrate surface.
A method of fabricating microstructures on a substrate, comprising the following steps in the order named:
Dependencies are inferred from the claim text.