High-volume millimeter scale manufacturing

A high-speed method for forming a millimeter-scale linkage laminate structure comprising:

• providing a first ply of relatively rigid mechanical material, said first ply having a first surface region and a second surface region disposed in substantially parallel spaced relation to said first surface region;
• coupling said first surface region of said first ply to a second ply of sacrificial film carrier material;
• applying a patterned photoresist material to said second surface region;
• selectively etching said first ply to form at least one substrate island and at least one chip island, said substrate and chip islands being respectively coupled to said second ply of sacrificial film carrier material;
• selectively coupling said at least one substrate island to a relatively flexible ply material to form said linkage laminate structure;
• and
• removing said second ply of sacrificial film carrier material to release said linkage laminate structure from said sacrificial film carrier material and said at least one chip island.