B81C 1/0015
Cantilevers
Official title: {Cantilevers (switches using MEMS H01H1/0036; electrostatic relays using micromechanics H01H59/0009; microelectro-mechanical resonators H03H9/02244)}
B81C1/0015 (Cantilevers) appears on 315 US grants and 327 published applications in this corpus.
Search patents in B81C- Granted patents
- 315
- Published applications
- 327
- Assignees
- 161
- Inventors
- 554
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1986 | 2 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 1 | 0 |
| 1994 | 1 | 0 |
| 1995 | 3 | 0 |
| 1996 | 2 | 0 |
| 1997 | 1 | 0 |
| 1998 | 6 | 0 |
| 1999 | 4 | 0 |
| 2000 | 3 | 0 |
| 2001 | 1 | 1 |
| 2002 | 2 | 6 |
| 2003 | 5 | 11 |
| 2004 | 12 | 10 |
| 2005 | 8 | 2 |
| 2006 | 2 | 4 |
| 2007 | 4 | 12 |
| 2008 | 7 | 6 |
| 2009 | 4 | 8 |
| 2010 | 7 | 14 |
| 2011 | 8 | 18 |
| 2012 | 6 | 7 |
| 2013 | 13 | 22 |
| 2014 | 21 | 20 |
| 2015 | 16 | 17 |
| 2016 | 27 | 36 |
| 2017 | 22 | 27 |
| 2018 | 31 | 28 |
| 2019 | 21 | 16 |
| 2020 | 27 | 16 |
| 2021 | 17 | 7 |
| 2022 | 7 | 6 |
| 2023 | 7 | 12 |
| 2024 | 2 | 3 |
| 2025 | 6 | 11 |
| 2026 | 8 | 7 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Normally-open piezoelectric MEMS valve8 Sep 2026US 12,729,781 B2Taiwan Semiconductor Manufacturing Company.Ltd
- MEMS sensor with a thin region1 Sep 2026US 12,726,773 B2Skyworks Solutions, Inc.
- Method of manufacturing a cantilever sensor19 May 2026US 12,635,414 B2Skyworks Solutions, Inc.
- Cantilevered piezoelectric microelectromechanical systems microphone with stress compensation10 Mar 2026US 12,570,520 B2Skyworks Solutions, Inc.
- Cantilever sensor with modified resonance frequency10 Mar 2026US 12,575,325 B2Skyworks Solutions, Inc.
- Alignment of substrate cavity13 Aug 2026US 2026/0233987 A1
- Acoustic devices with directional reinforcement23 Jul 2026US 2026/0209035 A1Skyworks Global Pte. Ltd.
- Vertical mems probe having tethering structure and manufacturing method thereof2 Jul 2026US 2026/0186021 A1Withmems Co., Ltd.
- Multidimensional cantilevers and stress-programmable out-of-plane interposers for 3-d photonic integration and control26 Mar 2026US 2026/0084954 A1The MITRE Corporation
- Semiconductor device and operating method thereof12 Mar 2026US 2026/0076269 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Microstructures and single mask, single-crystal process for fabrication thereof160US 5,719,073 ACornell Research Foundation, Inc. · 1998
- Process for masking and removal of residue from complex shapes147US 8,518,832 B1Western Digital (Fremont), LLC · 2013
- Electrically isolated released microstructures133US 5,847,454 ACornell Research Foundcatton, Inc. · 1998
- Microstructures and high temperature isolation process for fabrication thereof124US 5,426,070 ACornell Research Foundation, Inc. · 1995
- Microstructure and single mask, single-crystal process for fabrication thereof117US 5,846,849 ACornell Research Foundation, Inc. · 1998