B81C 1/00055
Grooves
Official title: {Grooves}
B81C1/00055 (Grooves) appears on 222 US grants and 290 published applications in this corpus.
Search patents in B81C- Granted patents
- 222
- Published applications
- 290
- Assignees
- 184
- Inventors
- 729
- Latest grant
- 14 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1991 | 1 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 1 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 1 | 0 |
| 2000 | 5 | 0 |
| 2001 | 1 | 0 |
| 2002 | 1 | 4 |
| 2003 | 6 | 8 |
| 2004 | 2 | 13 |
| 2005 | 0 | 5 |
| 2006 | 5 | 10 |
| 2007 | 5 | 16 |
| 2008 | 5 | 7 |
| 2009 | 6 | 7 |
| 2010 | 8 | 15 |
| 2011 | 6 | 16 |
| 2012 | 9 | 17 |
| 2013 | 12 | 10 |
| 2014 | 13 | 4 |
| 2015 | 12 | 8 |
| 2016 | 5 | 8 |
| 2017 | 8 | 17 |
| 2018 | 9 | 10 |
| 2019 | 9 | 18 |
| 2020 | 15 | 17 |
| 2021 | 17 | 27 |
| 2022 | 10 | 13 |
| 2023 | 14 | 15 |
| 2024 | 15 | 12 |
| 2025 | 12 | 9 |
| 2026 | 9 | 4 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Systems and methods for fabricating a 2D-material-based quantum sensor chip14 Jul 2026US 12,685,199 B2Toyota Jidosha Kabushiki Kaisha
- Wafer level proximity sensor and method of making same16 Jun 2026US 12,655,017 B2STMicroelectronics International N. V.
- Systems and methods for formation of continuous channels within transparent materials26 May 2026US 12,636,733 B2Avava, Inc.
- Biomaterial detection sensor and method of manufacturing the same19 May 2026US 12,631,572 B2Samsung Electronics Co., Ltd.
- MEMS with over-voltage protection12 May 2026US 12,623,900 B1SiTime Corporation
- Wafer level proximity sensor and method of making same1 Oct 2026US 2026/0296880 A1STMicroelectronics International N. V.
- MEMS with Reduced Acoustic Impedance6 Aug 2026US 2026/0230743 A1Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e. V.
- Method for singulating a wafer and suitable device21 May 2026US 2026/0138869 A1Carl Zeiss SMT GmbH
- Method of manufacturing a layered structure for a mems apparatus and mems apparatus having such a layered structure26 Feb 2026US 2026/0054980 A1OQmented GmbH
- Molded fluidic integrated circuit dies with embedded via structures25 Dec 2025US 2025/0388461 A1Hewlett-Packard Development Company, L. P.
Most cited
By later US patents
- Microfluidic structure and process for its manufacture704US 5,376,252 APharmacia Biosensor AB · 1994
- Polymer-based micromachining for microfluidic devices351US 6,136,212 AThe Regents of the University of Michigan · 2000
- Formation of microchannels from low-temperature plasma-deposited silicon oxynitride169US 6,096,656 ASandia Corporation · 2000
- Microfluidic channel fabrication method95US 6,210,986 B1Sandia Corporation · 2001
- Nanochannel arrays and their preparation and use for high throughput macromolecular analysis86US 7,670,770 B2The Trustees of Princeton University · 2010