B81B 3/0013
Structures dimensioned for mechanical prevention of stiction
Official title: {Structures dimensioned for mechanical prevention of stiction, e.g. spring with increased stiffness}
B81B3/0013 (Structures dimensioned for mechanical prevention of stiction) appears on 83 US grants and 90 published applications in this corpus.
Search patents in B81B- Granted patents
- 83
- Published applications
- 90
- Assignees
- 46
- Inventors
- 176
- Latest grant
- 1 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1994 | 1 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 1 | 0 |
| 1998 | 2 | 0 |
| 1999 | 0 | 0 |
| 2000 | 1 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 1 |
| 2003 | 0 | 0 |
| 2004 | 1 | 1 |
| 2005 | 1 | 0 |
| 2006 | 0 | 2 |
| 2007 | 1 | 4 |
| 2008 | 3 | 1 |
| 2009 | 2 | 3 |
| 2010 | 2 | 1 |
| 2011 | 1 | 1 |
| 2012 | 1 | 2 |
| 2013 | 1 | 3 |
| 2014 | 1 | 5 |
| 2015 | 5 | 7 |
| 2016 | 7 | 7 |
| 2017 | 6 | 6 |
| 2018 | 4 | 4 |
| 2019 | 6 | 5 |
| 2020 | 4 | 5 |
| 2021 | 6 | 5 |
| 2022 | 3 | 6 |
| 2023 | 9 | 7 |
| 2024 | 4 | 6 |
| 2025 | 4 | 2 |
| 2026 | 6 | 6 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Micro-electro-mechanical system device1 Sep 2026US 12,722,968 B2Vanguard International Semiconductor Corporation
- Systems and methods to reduce stiction in MEMS devices7 Jul 2026US 12,674,973 B2Texas Instruments Incorporated
- Package structure, apparatus and forming methods thereof26 May 2026US 12,641,370 B2xMEMS Labs, Inc.
- MEMS bump stopper surface features5 May 2026US 12,617,670 B2Knowles Electronics, LLC
- Microelectromechanical system and method for manufacturing a microelectromechanical system20 Jan 2026US 12,528,694 B2Robert Bosch GmbH
- Systems and methods to reduce stiction in mems devices1 Oct 2026US 2026/0299283 A1Texas Instruments Incorporated
- Systems and Apparatus for Micromirror Designs with Electrode Contact26 Mar 2026US 2026/0086349 A1
- Microelectromechanical system device with filled via12 Mar 2026US 2026/0070778 A1
- Forming methods of package structure and apparatus12 Mar 2026US 2026/0075366 A1xMEMS Labs, Inc.
- Microelectromechanical system device with elongated via5 Feb 2026US 2026/0036805 A1
Most cited
By later US patents
- Capacitive surface micromachined differential pressure sensor112US 5,332,469 AFord Motor Company · 1994
- Microelectromechanical system (MEMS) device and fabrication method thereof46US 9,126,827 B2Solid State System Co., Ltd. · 2015
- Method to prevent adhesion of micromechanical structures24US 5,772,902 ACarnegie Mellon University · 1998
- Ultra-low voltage capable zipper switch19US 7,321,275 B2Intel Corporation · 2008
- MEMS device having flexures with non-linear restoring force18US 6,806,545 B2Samsung Electronics Co., Ltd. · 2004