Systems and methods to reduce stiction in MEMS devices
AssigneeTexas Instruments Incorporated
InventorsLisa Wesneski, Toby Linder, Timothy Patterson
Life of this patent
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Abstract
Systems and methods to reduce stiction in MEMS devices are disclosed. A microelectromechanical system (MEMS) device includes a substrate; a via supported by the substrate, the via comprising a first metal layer comprising a material; an arm extending away from and supported by the via, the arm comprising the material; and a second metal layer within the via on the first metal layer, wherein the second metal layer comprises nitrogen.
Claims19
A microelectromechanical system (MEMS) device comprising:
- a substrate;
- a via supported by the substrate, the via comprising a first conductive layer, the via having a bottom and sidewalls;
- a conductive member extending away from and supported by the via;
- and
- a second conductive layer in the via over the first conductive layer along the bottom of the via and along the sidewalls of the via, wherein the second conductive layer comprises nitrogen.
A microelectromechanical system (MEMS) device comprising:
- a substrate;
- a hinge;
- a micromirror over the hinge;
- and
- a via coupling the substrate and the hinge, the via comprising:
- a first conductive layer;
- and
- a second conductive layer on the first conductive layer.
A method of manufacturing a microelectromechanical system (MEMS) device, the method comprising:
- forming an opening in a sacrificial material supported by a substrate;
- depositing a first conductive layer over the sacrificial material, the first conductive layer extending into the opening;
- depositing a second conductive layer on the first conductive layer, the second conductive layer deposited over the first conductive layer within the opening;
- depositing a third conductive layer on the second conductive layer, the third conductive layer covering the second conductive layer within the opening;
- removing the third conductive outside of the opening;
- and
- removing the second conductive layer to expose the first conductive layer outside of the opening.
A method of manufacturing a microelectromechanical system (MEMS) device, the method comprising:
- forming an opening in a sacrificial material supported by a substrate;
- depositing a first conductive layer over the sacrificial material, the first conductive layer extending into the opening;
- depositing a second conductive layer on the first conductive layer, the second conductive layer deposited over the first conductive layer within the opening;
- removing the second conductive layer to expose the first conductive layer outside of the opening;
- and
- patterning the first conductive layer to form a spring tip in the first conductive layer.
Dependencies are inferred from the claim text.