MEMS bump stopper surface features
AssigneeKnowles Electronics, LLC
InventorsKen Deng, Bing Yu, Michael Pedersen, Nicholas Palcheck, Jeremy Johnson, Richard Li-Chen Chen
Life of this patent
Estimating the term…
Abstract
A microelectromechanical system (MEMS) sensor assembly comprises a substrate, a bump stopper extending from the substrate, and a sensor suspended relative to the substrate. The sensor is configured to move relative to the substrate, wherein the bump stopper is configured to restrain the sensor travel distance and prevent contact between the sensor and the substrate. The bump stopper has a surface facing the sensor, wherein an area of contact between the sensor and the surface is less than the total area of the surface.
Claims9
A microelectromechanical system (MEMS) sensor assembly, comprising:
- a substrate;
- a bump stopper extending from the substrate;
- and
- a sensor suspended relative to the substrate, the sensor configured to move relative to the substrate, wherein the bump stopper is configured to restrain the sensor travel distance and prevent contact between the sensor and the substrate, the bump stopper having a surface facing the sensor;
- wherein an area of contact between the sensor and the surface is less than the total area of the surface;
- wherein the surface includes a region of recess and one or more regions that protrude toward the sensor relative to the rest of the surface;
- and
- wherein said region of recess is curved.
A microelectromechanical system (MEMS) sensor assembly, comprising:
- a substrate;
- a sensor suspended relative to the substrate, the sensor configured to move relative to the substrate;
- and
- a bump stopper extending from the substrate at a first end of the bump stopper, the bump stopper having a surface facing the sensor on a second end distal from the substrate, wherein the bump stopper is configured to restrain the sensor travel distance and prevent contact between the sensor and the substrate;
- wherein an area of contact area between the sensor and the surface is less than the total area of the surface;
- and
- wherein the surface includes a region of recess surrounded by one or more regions that protrude toward the sensor relative to the rest of the surface;
- and
- wherein said region of recess is one of concave and convex.
A microelectromechanical system (MEMS) sensor assembly, comprising:
- a substrate;
- a sensor suspended relative to the substrate, the sensor configured to move relative to the substrate;
- and
- a bump stopper extending from the substrate at a first end of the bump stopper, the bump stopper having a surface facing the sensor on a second end distal from the substrate, wherein the bump stopper is configured to restrain the sensor travel distance and prevent contact between the sensor and the substrate;
- wherein an area of contact area between the sensor and the surface is less than the total area of the surface;
- wherein the surface includes a region of recess surrounded by one or more regions that protrude toward the sensor relative to the rest of the surface;
- and
- wherein said region of recess is a non-flat surface and said one or more regions that protrude are planar surfaces.
Dependencies are inferred from the claim text.