B24B 37/0056
Taking regard of the ph-value of lapping agents
Official title: {taking regard of the pH-value of lapping agents}
B24B37/0056 (Taking regard of the ph-value of lapping agents) appears on 89 US grants and 108 published applications in this corpus.
Search patents in B24B- Granted patents
- 89
- Published applications
- 108
- Assignees
- 58
- Inventors
- 260
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2000 | 1 | 0 |
| 2001 | 6 | 3 |
| 2002 | 11 | 18 |
| 2003 | 10 | 16 |
| 2004 | 7 | 10 |
| 2005 | 12 | 7 |
| 2006 | 9 | 9 |
| 2007 | 7 | 5 |
| 2008 | 5 | 6 |
| 2009 | 1 | 1 |
| 2010 | 1 | 6 |
| 2011 | 1 | 4 |
| 2012 | 2 | 2 |
| 2013 | 3 | 1 |
| 2014 | 3 | 1 |
| 2015 | 1 | 2 |
| 2016 | 1 | 0 |
| 2017 | 0 | 1 |
| 2018 | 1 | 1 |
| 2019 | 1 | 0 |
| 2020 | 0 | 6 |
| 2021 | 1 | 1 |
| 2022 | 1 | 0 |
| 2023 | 2 | 0 |
| 2024 | 1 | 3 |
| 2025 | 0 | 5 |
| 2026 | 1 | 0 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
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Most cited
By later US patents
- Apparatus for controlling PH during planarization and cleaning of microelectronic substrates80US 6,368,194 B1Micron Technology, Inc. · 2002
- Method for controlling pH during planarization and cleaning of microelectronic substrates55US 6,220,934 B1Micron Technology, Inc. · 2001
- Polishing slurry and method for chemical-mechanical polishing49US 6,271,139 B1Micron Technology, Inc. · 2001
- Method and apparatus for chemical-mechanical planarization of microelectronic substrates with selected planarizing liquids42US 6,383,934 B1Micron Technology, Inc. · 2002
- Chemical mechanical polishing compositions for metal and associated materials and method of using same42US 6,692,546 B2Advanced Technology Materials, Inc. · 2004