Cationic fluoropolymer composite polishing method
AssigneeRohm and Haas Electronic Materials CMP Holdings, Inc.
InventorMatthew R. Gadinski
Life of this patent
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Abstract
The invention provides a method for polishing or planarizing a substrate of at least one of semiconductor, optical and magnetic substrates. The method includes attaching a polymer-polymer composite polishing pad having a polishing layer to a polishing device. A hydrophilic polymeric matrix forms the polishing layer. Cationic fluoropolymer particles having nitrogen-containing end groups are embedded in the polymeric matrix. A slurry containing anionic particles is applied to the polymer-polymer composite polishing pad and rubbed against the substrate to polish or planarize the substrate with the fluoropolymer particles interacting with the anionic particles to increase polishing removal rate.
Claims10
A method for polishing or planarizing a substrate of at least one of semiconductor, optical and magnetic substrates, the method comprising the following:
- attaching a polymer-polymer composite polishing pad to a polishing device, the polymer-polymer polishing pad having a polishing layer, the polishing layer having a polishing surface for polishing or planarizing the substrate, a polymeric matrix forming the polishing layer, the polymer matrix being a first polymer, the first polymer being hydrophilic as measured with distilled water at a pH of 7 at a surface roughness of 10 μm rms after soaking in distilled water for five minutes and the first polymer not being a fluoropolymer, and cationic fluoropolymer particles embedded in the polymeric matrix, the cationic fluoropolymer particles having nitrogen-containing end groups, the nitrogen-containing end groups concentrating at the surface of the cationic fluoropolymer particles, the cationic fluoropolymer particles having a cationic zeta potential as measured in distilled water at a pH of 7;
- applying a slurry to the polymer-polymer composite polishing pad, the slurry containing anionic particles;
- and
- rubbing the polymer-polymer composite polishing pad against the substrate to polish or planarize the substrate with the fluoropolymer particles interacting with the anionic particles to increase polishing removal rate of the substrate.
A method for polishing or planarizing a substrate of at least one of semiconductor, optical and magnetic substrates, the method comprising the following:
- attaching a polymer-polymer composite polishing pad to a polishing device, the polymer-polymer polishing pad having a polishing layer, the polishing layer having a polishing surface for polishing or planarizing the substrate, a polymeric matrix forming the polishing layer, the polymer matrix being a first polymer, the first polymer being hydrophilic as measured with distilled water at a pH of 7 at a surface roughness of 10 μm rms after soaking in distilled water for five minutes and the first polymer not being a fluoropolymer, and cationic polyvinylfluoride particles embedded in the polymeric matrix, the cationic polyvinylfluoride particles having nitrogen-containing end groups, the nitrogen-containing end groups concentrating at the surface of the cationic polyvinylfluoride particles, the cationic polyvinylfluoride particles having a cationic zeta potential as measured in distilled water at a pH of 7;
- applying a slurry to the polymer-polymer composite polishing pad, the slurry containing anionic particles;
- and
- rubbing the polymer-polymer composite polishing pad against the substrate to polish or planarize the substrate with the polyvinylfluoride particles interacting with the anionic particles to increase polishing removal rate of the substrate.
Dependencies are inferred from the claim text.