Apparatus and method for in-situ chemical separation and recirculation in a chemical mechanical processing system
AssigneeAxus Technology, LLC
InventorsDaniel Ray Trojan, John Kevin Shugrue
Life of this patent
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Abstract
An apparatus and method for in-situ chemical separation and recirculation in a chemical mechanical processing system are provided. In one aspect, a chemical mechanical planarization system includes a polishing platen having a surface configured to polish a substrate and a slurry delivery system configured to deliver slurry to the surface of the polishing platen. The apparatus can further include an effluent capture apparatus configured to capture the slurry from the polishing platen, filter the captured slurry, and provide the filtered slurry to the slurry delivery system.
Claims26
A chemical mechanical planarization (CMP) system, comprising:
- a polishing platen having a surface configured to polish a substrate;
- a slurry delivery system configured to deliver slurry to the surface of the polishing platen;
- and
- a slurry recirculation system configured to capture the slurry from the polishing platen, filter the captured slurry, and provide the filtered slurry to the slurry delivery system.
A slurry recirculation system, comprising:
- an effluent capture apparatus including a capture trough configured to capture slurry that flows off an edge of a polishing platen of a chemical mechanical planarization (CMP) system;
- a drainage system configured to receive the captured slurry from the capture trough;
- and
- a reclaim system configured to receive the captured slurry from the drainage system and filter the captured slurry, the reclaim system including a slurry return configured to return the filtered slurry to a slurry delivery system of the CMP system.
A method of capturing and reusing slurry from a chemical mechanical planarization (CMP) system, comprising:
- polishing a substrate using a surface of a polishing platen of the CMP system;
- delivering slurry to the surface of the polishing platen;
- capturing the slurry from the polishing platen;
- filtering the captured slurry;
- and
- providing the filtered slurry to a slurry delivery system of the CMP system.
Dependencies are inferred from the claim text.