Fluopolymer composite CMP polishing method

A method for polishing or planarizing a substrate of at least one of semiconductor, optical and magnetic substrates, the method comprising the following:

• attaching a polymer-polymer composite polishing pad to a polishing device, the polymer-polymer composite polishing pad comprising a polishing layer having a polishing surface for polishing or planarizing the substrate, a polymeric matrix forming the polishing layer, the polymer matrix having a tensile strength, and fluoropolymer particles embedded in the polymeric matrix, the fluoropolymer particles having a tensile strength lower than the tensile strength of the polymeric matrix and the fluoropolymer particles having a zeta potential more negative than the polymeric matrix at a pH of 7;
• applying a cationic particle-containing slurry to the polymer-polymer composite polishing pad;
• conditioning the polymer-polymer composite polishing pad to expose the fluoropolymer particles to the polishing surface and to create fluoropolymer-containing debris particles in the slurry;
• and
• polishing or planarizing the substrate with the increased electronegativity from fluoropolymer at the polishing surface and in the fluoropolymer-containing debris particles stabilizing the cationic particle-containing slurry to decrease precipitation rate of the cationic particle-containing slurry.