Low-debris fluopolymer composite CMP polishing pad

A polymer-polymer composite polishing pad useful for polishing or planarizing a substrate of at least one of semiconductor, optical and magnetic substrates, the polymer-polymer composite polishing pad comprising the following:

• a polishing layer having a polishing surface for polishing or planarizing the substrate;
• a polymeric matrix forming the polishing layer, the polymer matrix having a tensile strength, the polymer matrix including gas-filled or liquid-filled polymeric microelements;
• and
• fluoropolymer particles embedded in the polymeric matrix between the gas-filled or liquid-filled polymeric microelements, the fluoropolymer particles having an average particle size less than the average spacing of the polymeric microelements, the fluoropolymer particles having a tensile strength lower than the tensile strength of the polymeric matrix wherein diamond abrasive materials cut the fluoropolymer to form a reduced number of pad debris particles in the 1 μm to 10 μm size range.