B24B 37/005
Control means for lapping machines or devices
B24B37/005 (Control means for lapping machines or devices) appears on 2,195 US grants and 2,228 published applications in this corpus.
Search patents in B24B- Granted patents
- 2,195
- Published applications
- 2,228
- Assignees
- 449
- Inventors
- 3,383
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 2 | 0 |
| 1983 | 1 | 0 |
| 1984 | 2 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 5 | 0 |
| 1988 | 7 | 0 |
| 1989 | 4 | 0 |
| 1990 | 5 | 0 |
| 1991 | 5 | 0 |
| 1992 | 8 | 0 |
| 1993 | 15 | 0 |
| 1994 | 13 | 0 |
| 1995 | 26 | 0 |
| 1996 | 22 | 0 |
| 1997 | 47 | 0 |
| 1998 | 49 | 0 |
| 1999 | 66 | 0 |
| 2000 | 80 | 0 |
| 2001 | 109 | 49 |
| 2002 | 101 | 113 |
| 2003 | 132 | 119 |
| 2004 | 95 | 91 |
| 2005 | 92 | 88 |
| 2006 | 105 | 76 |
| 2007 | 74 | 65 |
| 2008 | 34 | 50 |
| 2009 | 33 | 41 |
| 2010 | 37 | 60 |
| 2011 | 31 | 48 |
| 2012 | 34 | 66 |
| 2013 | 47 | 61 |
| 2014 | 57 | 99 |
| 2015 | 65 | 104 |
| 2016 | 85 | 75 |
| 2017 | 68 | 61 |
| 2018 | 58 | 72 |
| 2019 | 61 | 112 |
| 2020 | 69 | 106 |
| 2021 | 46 | 97 |
| 2022 | 54 | 114 |
| 2023 | 111 | 115 |
| 2024 | 102 | 138 |
| 2025 | 82 | 113 |
| 2026 | 54 | 95 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Optical thickness control during a chemical mechanical polishing process and apparatus for effecting the same6 Oct 2026US 12,752,390 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Substrate polishing apparatus6 Oct 2026US 12,752,391 B2Kctech Co., Ltd.
- Polishing method for gallium nitride wafer6 Oct 2026US 12,757,663 B2Disco Corporation
- System and method for controlling chemical mechanical planarization29 Sep 2026US 12,751,254 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Polishing pad, polishing apparatus, and polishing method22 Sep 2026US 12,741,354 B2Ebara Corporation
- Method and Apparatus for Generating a Reciprocating Sanding or Polishing Path8 Oct 2026US 2026/0307199 A1ABB Schweiz AG
- Semiconductor processing tool and methods of operation8 Oct 2026US 2026/0307200 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Polishing method, polishing apparatus, and computer-readable storage medium8 Oct 2026US 2026/0307201 A1Ebara Corporation
- Chemical mechanical polishing temperature scanning apparatus for temperature control8 Oct 2026US 2026/0307202 A1APPLIED Materials.Inc.
- Polishing method and polishing apparatus1 Oct 2026US 2026/0295763 A1Ebara Corporation
Most cited
By later US patents
- Plasma monitoring and control method and system625US 5,576,629 AFourth State Technology, Inc. · 1996
- Plasma monitoring and control method and system503US 5,939,886 AAdvanced Energy Industries, Inc. · 1999
- Indirect endpoint detection by chemical reaction and chemiluminescence486US 6,126,848 AInternational Business Machines Corporation · 2000
- Apparatus and method for determining wafer temperature using pyrometry475US 5,305,417 ATexas Instruments Incorporated · 1994
- In-situ endpoint detection and process monitoring method and apparatus for chemical-mechanical polishing472US 5,433,651 AInternational Business Machines Corporation · 1995