B24B 37/0053
Detecting loss or breakage of a workpiece during lapping
Official title: {detecting loss or breakage of a workpiece during lapping}
B24B37/0053 (Detecting loss or breakage of a workpiece during lapping) appears on 59 US grants and 50 published applications in this corpus.
Search patents in B24B- Granted patents
- 59
- Published applications
- 50
- Assignees
- 32
- Inventors
- 139
- Latest grant
- 11 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1995 | 1 | 0 |
| 1996 | 1 | 0 |
| 1997 | 0 | 0 |
| 1998 | 3 | 0 |
| 1999 | 4 | 0 |
| 2000 | 1 | 0 |
| 2001 | 5 | 1 |
| 2002 | 5 | 3 |
| 2003 | 4 | 5 |
| 2004 | 5 | 3 |
| 2005 | 1 | 1 |
| 2006 | 3 | 0 |
| 2007 | 0 | 0 |
| 2008 | 0 | 1 |
| 2009 | 0 | 2 |
| 2010 | 1 | 1 |
| 2011 | 1 | 0 |
| 2012 | 1 | 1 |
| 2013 | 0 | 0 |
| 2014 | 2 | 2 |
| 2015 | 0 | 3 |
| 2016 | 2 | 5 |
| 2017 | 0 | 2 |
| 2018 | 1 | 0 |
| 2019 | 1 | 3 |
| 2020 | 3 | 1 |
| 2021 | 1 | 4 |
| 2022 | 1 | 1 |
| 2023 | 2 | 3 |
| 2024 | 4 | 3 |
| 2025 | 1 | 2 |
| 2026 | 5 | 3 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
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Most cited
By later US patents
- Rotary union for coupling fluids in a wafer polishing apparatus110US 5,443,416 ACybeq Systems, Inc. · 1995
- Carrier head with a substrate detection mechanism for a chemical mechanical polishing system99US 5,957,751 AAPPLIED Materials.Inc. · 1999
- Wafer polisher head adapted for easy removal of wafers75US 5,527,209 ACybeq Systems, Inc. · 1996
- Wafer carrier for semiconductor wafer polishing machine63US 5,916,015 ASpeedfam Corporation · 1999
- Methods for the in-process detection of workpieces with a monochromatic light source54US 5,961,369 ASpeedFam-IPEC Corporation · 1999