Carrier head with a substrate detection mechanism for a chemical mechanical polishing system
AssigneeApplied Materials, Inc.
InventorsBoris Govzman, Steven M. Zuniga, Hung Chen, Sasson Somekh
Life of this patent
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Abstract
A carrier head for a chemical mechanical polishing system includes a substrate sensing mechanism. The carrier head includes a base and a flexible member connected to the base to define a chamber. A lower surface of the flexible member provides a substrate receiving surface. The substrate sensing mechanism includes a sensor to measure a pressure in the chamber and generate an output signal representative thereof, and a processor configured to indicate whether the substrate is attached to the substrate receiving surface in response to the output signal.
Claims38
A carrier head for a chemical mechanical polishing system, comprising:
- a base;
- a first flexible member connected to the base to define a first chamber, a lower surface of the first flexible member providing a substrate receiving surface;
- a second chamber in the base;
- a passage through the base between the first and second chamber;
- and
- a valve located in the passage to fluidly couple the first chamber and the second chamber.
An assembly for a chemical mechanical polishing system, comprising:
- a carrier head including a base, a first flexible member connected to the base to define a first chamber, a lower surface of the first flexible member providing a substrate receiving surface, a second flexible member connected to the base to define a second chamber, and a valve to fluidly couple the first chamber to the second chamber, the valve configured such that, if a fluid is evacuated from the first chamber and a generally flat substrate is not chucked to the substrate receiving surface, the first flexible member deflects to actuate the valve so that a pressure in the second chamber reaches a first pressure which differs from a second pressure that would result if the substrate were attached to the substrate receiving surface;
- a vacuum source fluidly coupled to the first chamber to evacuate the first chamber;
- a pressure source fluidly coupled to the second chamber to pressurize the second chamber;
- a pressure sensor to measure the pressure in the second chamber at a first time and a second time and generate output signals representative of the pressures;
- and
- a processor, in response to the output signals, configured to indicate whether the substrate is chucked to the carrier head by determining whether the first pressure is less than the second pressure.
A carrier head assembly for a chemical mechanical polishing system, comprising:
- a base;
- a flexible membrane connected to the base to define a first chamber, a lower surface of the flexible membrane providing a substrate receiving surface;
- a first passage in the base to fluidly couple the first chamber to a fluid source;
- and
- a second passage in the base to fluidly couple the first chamber to a vacuum source, wherein at least one of the passages and the flexible membrane are configured such that, if a fluid is evacuated from the first chamber and a generally flat substrate is not chucked to the substrate receiving surface, the flexible membrane deflects so as to open or close at least one of the first and second passages.
An assembly for a chemical mechanical polishing system, comprising:
- a base;
- a flexible membrane connected to the base to define a chamber, a lower surface of the flexible membrane providing a substrate receiving surface;
- a first passage in the base to connect the chamber to a fluid source;
- a second passage in the base to connect the chamber to a vacuum source, wherein at least one of the passages and the flexible membrane are configured such that, if a fluid is evacuated from the chamber and a generally flat substrate is not chucked to the substrate receiving surface, the flexible membrane deflects so as to open or close at least one of the first and second passages;
- a vacuum source connected to the second passage to evacuate the chamber;
- a sensor to measure a pressure and generate an output signal representative thereof, the pressure being different depending upon whether the at least one of the first and second passages is opened or closed;
- and
- a processor configured to indicate whether the substrate is chucked to the substrate receiving surface in response to the output signal.
A carrier head for a chemical mechanical polishing system, comprising:
- a base;
- a first flexible member connected to the base to define a first chamber, a lower surface of the first flexible member providing a substrate receiving surface;
- a second chamber adjacent the base;
- a passage through the base between the first and second chamber;
- and
- a valve located in the passage to fluidly couple the first chamber and the second chamber.
Dependencies are inferred from the claim text.