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US 2026/0249418 A1Published application
Polishing apparatus
AssigneeEbara Corporation
InventorsToshifumi KIMBA, Masaki KINOSHITA
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Abstract
A polishing apparatus capable of determining a state change of a wafer more accurately and with faster responsiveness is disclosed. The polishing apparatus includes a detection device and a control device. The detection device periodically detects a reference position rotating together with a polishing head. The control device determines a state change of a substrate based on the reference position periodically detected by the detection device.
Claims8
A polishing apparatus comprising:
- a polishing table configured to support a polishing pad;
- a polishing head configured to hold a substrate with an exposed surface of the substrate facing a polishing surface of the polishing pad;
- a detection device configured to detect a reference position of the substrate;
- and
- a control device electrically connected to the detection device,
- wherein the detection device is configured to periodically detect the reference position rotating together with the polishing head, and
- wherein the control device is configured to determine a state change of the substrate based on the reference position periodically detected by the detection device.
4 more elements
Dependencies are inferred from the claim text.