Substrate processing apparatus, and abnormality determination method
AssigneeEbara Corporation
InventorYoshimasa OZONE
Life of this patent
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Abstract
Abnormality is determined with respect to delivery of a substrate to a transfer stage from a substrate holding device for a substrate polishing process. A substrate processing apparatus includes an abnormality determiner that determines abnormal delivery of the substrate to the transfer stage from the substrate holding device, based on a time difference between a first timing at which a first sensor detects that the substrate is placed on a placement surface of the transfer stage, and a second timing at which a second sensor detects that the substrate is placed on the placement surface.
Claims7
A substrate processing apparatus for performing a polishing process on a surface to be polished of a substrate, comprising:
- a polishing table for supporting a polishing pad;
- a substrate holding device having a substrate holding surface and a pressure chamber composed of an elastic film, and configured to hold the substrate on the substrate holding surface and press the substrate to the polishing pad by pressure in the pressure chamber;
- a transfer stage having a placement surface on which the substrate is placed, and configured so that the substrate is delivered to the placement surface from the substrate holding device by a detachment operation of the substrate by the substrate holding device;
- a plurality of sensors including a first sensor and a second sensor configured to detect different sites of the substrate to detect that the substrate is placed on the placement surface;
- and
- an abnormality determiner that determines abnormal delivery of the substrate to the transfer stage from the substrate holding device, based on a time difference between a first timing at which the first sensor detects that the substrate is placed on the placement surface, and a second timing at which the second sensor detects that the substrate is placed on the placement surface.
An abnormality determination method that determines abnormal delivery of a substrate in a substrate processing apparatus, wherein the substrate processing apparatus comprises
- a polishing table for supporting a polishing pad,
- a substrate holding device having a substrate holding surface and a pressure chamber composed of an elastic film, and configured to hold the substrate on the substrate holding surface and press the substrate to the polishing pad by pressure in the pressure chamber, and
- a transfer stage having a placement surface on which the substrate is placed, and configured so that the substrate is delivered to the placement surface from the substrate holding device by a detachment operation of the substrate by the substrate holing device,
- the abnormality determination method, comprising determining abnormal delivery of the substrate to the transfer stage from the substrate holding device, based on a time difference between a first timing at which it is detected that a first site of the substrate is placed on the placement surface, and a second timing at which it is detected that a second site different from the first site of the substrate is placed on the placement surface, when it is determined that the substrate is placed on the placement surface.
Dependencies are inferred from the claim text.