Information processing apparatus, inference apparatus, machine-learning apparatus, information processing method, inference method, and machine-learning method
AssigneeEbara Corporation
InventorSeungho YUN
Life of this patent
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AssigneeEbara Corporation
InventorSeungho YUN
Estimating the term…
An information processing apparatus (5) includes: an information acquisition section (500) configured to acquire polishing condition information including top-ring vibration information indicating vibration of a top ring in chemical mechanical polishing of the substrate and top-ring sound information indicating sound generated from the top ring in the chemical mechanical polishing of the substrate performed by a substrate processing apparatus including a polishing table rotatably supporting the polishing pad and the top ring configured to press the substrate against the polishing pad; and a state prediction section (501) configured to predict substrate slip-out information for the polishing condition information by inputting the polishing condition information acquired by the information acquisition section (500) to a learning model (10A) that has been generated by machine learning that causes the learning model to learn a correlation between the polishing condition information and the substrate slip-out information indicating occurrence of slip out of the substrate on which the chemical mechanical polishing is performed.
An information processing apparatus comprising:
An inference apparatus comprising:
A machine-learning apparatus comprising:
An information processing method comprising:
An inference method executed by an inference apparatus including a memory and a processor, the processor performing:
A machine-learning method comprising:
Dependencies are inferred from the claim text.